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SPI315-64

Onsemi

SPI315-64 by Onsemi

SPI315-64 by Onsemi is a Linear Position Sensor with VCEsat of 0.5V, Response Time of 5us, and Operating Temp range from -20 to 80 °C. Ideal for applications requiring precise position sensing in tight spaces due to its surface mount feature and gap size of 0.001mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Vyrian

USA . 2,449 parts In-Stock

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Digiode

USA . 1,565 parts In-Stock

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TANS Electronics

Latvia . 7,356 parts In-Stock

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Problanco Electronics

Mexico . 6,621 parts In-Stock

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Kulean Microsystems

USA . 5,771 parts In-Stock

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SupplyDigital Components

Austria . 5,552 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 352 parts In-Stock

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Overview

Discover the unparalleled precision and reliability of the SPI315-64 linear position sensor by Onsemi. Manufactured by a trusted industry leader, this sensor is designed to deliver exceptional performance in a wide range of applications. Whether you need accurate measurement in automotive systems or industrial machinery, this sensor offers unparalleled value with its fast response time, low VCEsat, and high output voltage. Trust Onsemi's expertise and experience to take your projects to the next level with the SPI315-64.

Feature Benefit Bullets

Maximum VCEsat: 0.5 V

Low VCEsat helps in reducing power dissipation and improving efficiency of the linear position sensor.

Output Circuit Type: Transistor

Transistor output circuit provides fast response time and accurate signal output for precise linear position sensing applications.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures reliable performance in varying environmental conditions.

Response Time: 5 us

Fast response time enables real-time feedback for positioning control and monitoring applications.

Minimum Operating Temperature: -20 °C

Wide operating temperature range allows the linear position sensor to function effectively in cold climates or industrial settings.

Maximum Output Voltage: 20 V

High output voltage capability enables compatibility with a wide range of control systems and interfaces.

Maximum Operating Current: 50 mA

Low operating current helps in minimizing power consumption and heat generation in the linear position sensor.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure installation on PCBs or other mounting surfaces.

Gap Size: 0.001 mm

Precise and small gap size ensures accurate measurement of linear position with high resolution.

Technical Specifications

Linear Position Sensors SPI315-64 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Transistor

Maximum Output Voltage:

20 V

Response Time:

5 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

.5 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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