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SPI327-05

Onsemi

SPI327-05 by Onsemi

SPI327-05 by Onsemi is a Linear Position Sensor with VCEsat of 1.2V, Output Voltage of 20V, and Operating Current up to 50mA. Ideal for applications requiring precise position sensing in environments ranging from -25 °C to 80°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

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Digiode

USA . 1,819 parts In-Stock

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Vyrian

USA . 1,368 parts In-Stock

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Problanco Electronics

Mexico . 7,792 parts In-Stock

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Kulean Microsystems

USA . 6,318 parts In-Stock

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SupplyDigital Components

Austria . 6,223 parts In-Stock

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TANS Electronics

Latvia . 5,734 parts In-Stock

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UHIMA Technologies

Türkiye . 859 parts In-Stock

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Corohmni

South Africa . 299 parts In-Stock

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Corphita

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Overview

Elevate your projects with the SPI327-05 by Onsemi, a top-quality linear position sensor that offers unmatched precision and reliability. Manufactured by the trusted brand Onsemi, this sensor is designed to exceed expectations in a wide range of applications. From industrial automation to automotive systems, the SPI327-05 delivers accurate measurements and seamless performance. Say goodbye to guesswork and hello to actionable data with this exceptional sensor. Unlock the full potential of your projects with the SPI327-05 today.

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

Low VCEsat indicates efficient operation and minimal power loss, making this sensor energy-efficient.

Output Circuit Type: Transistor

Transistor-based output circuit is reliable and allows for easy integration with various electronic systems.

Maximum Operating Temperature: 80 °C

High operating temperature range ensures the sensor can be used in a variety of environments without performance degradation.

Minimum Operating Temperature: -25 °C

Wide temperature range allows for use in both extreme cold and hot conditions, making this sensor versatile.

Maximum Output Voltage: 20 V

High output voltage capability provides strong signal strength and allows for accurate position detection.

Maximum Operating Current: 50 mA

Low operating current ensures the sensor consumes minimal power, contributing to energy efficiency.

Maximum Output Current: 2.5 A

High output current capacity enables the sensor to drive external loads or circuits, expanding its usability.

Gap Size: 0.002 mm

Extremely small gap size allows for precise and accurate position sensing, making this sensor ideal for applications requiring high precision.

Technical Specifications

Linear Position Sensors SPI327-05 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.002 mm

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Maximum Output Current:

2.5 A

Maximum Output Voltage:

20 V

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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