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SPI335-35

Onsemi

SPI335-35 by Onsemi

SPI335-35 by Onsemi is a Linear Position Sensor with Max VCEsat of 1.2V, Darlington Output Circuit Type, and 80 °C Max Operating Temp. Ideal for applications requiring precise position sensing in harsh environments due to its fast response time of 100μs and wide operating temperature range from -20°C to 80°C.

Median Price

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Lifecycle Status

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Vyrian

USA . 2,454 parts In-Stock

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Digiode

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TANS Electronics

Latvia . 6,244 parts In-Stock

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Kulean Microsystems

USA . 5,616 parts In-Stock

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Problanco Electronics

Mexico . 1,207 parts In-Stock

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SupplyDigital Components

Austria . 988 parts In-Stock

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UHIMA Technologies

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Corphita

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Corohmni

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Overview

Enhance your product performance with the SPI335-35 by Onsemi! As a leading manufacturer of linear position sensors, Onsemi guarantees top-quality products that deliver precise and reliable results. This sensor is perfect for applications requiring fast response times and high accuracy, making it ideal for a wide range of industries. With a maximum VCEsat of 1.2V and a maximum output current of 15A, the SPI335-35 offers exceptional value and benefits to customers looking to improve their systems' efficiency and productivity. Trust Onsemi to provide you with the best quality sensors for your needs.

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

Low VCEsat ensures minimal power loss and high efficiency in the operation of the sensor.

Output Circuit Type: Darlington

Darlington circuit provides high current gain and high input impedance, enhancing the sensor's performance and sensitivity.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows the sensor to function effectively in various environmental conditions.

Response Time: 100 us

Fast response time ensures quick and accurate detection of position changes, making the sensor suitable for real-time applications.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows the sensor to operate in cold environments without any performance issues.

Maximum Output Voltage: 20 V

High output voltage provides strong signal output, making the sensor reliable for long-distance transmission of position data.

Maximum Operating Current: 50 mA

Low operating current requirement results in minimal power consumption, increasing the overall efficiency of the sensor.

Maximum Output Current: 15 A

High output current capability allows the sensor to handle heavy loads, making it suitable for industrial applications.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting provides secure and stable installation of the sensor, ensuring accurate and consistent position detection.

Gap Size: 0.001 mm

Extremely small gap size allows for precise and fine position sensing, making the sensor ideal for applications requiring high accuracy.

Technical Specifications

Linear Position Sensors SPI335-35 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Maximum Output Current:

15 A

Maximum Output Voltage:

20 V

Response Time:

100 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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