Loading...

SLR732A10

Onsemi

SLR732A10 by Onsemi

SLR732A10 by Onsemi is an Infrared LED with peak wavelength of 850nm, max forward current of 0.1A, and reverse voltage of 3V. Ideal for applications requiring IR illumination in temp range -25 °C to 80°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,708

-

-

-

-

Vyrian

USA . 533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

533

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,889

-

-

-

-

SupplyDigital Components

Austria . 5,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,395

-

-

-

-

TANS Electronics

Latvia . 4,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,276

-

-

-

-

Problanco Electronics

Mexico . 3,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,775

-

-

-

-

Corphita

USA . 1,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

-

-

-

-

Corohmni

South Africa . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

375

-

-

-

-

UHIMA Technologies

Türkiye . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Overview

Illuminate your world with the SLR732A10 Infrared LED by Onsemi. Crafted with precision and quality, this product offers peak performance in a wide range of applications. From security cameras to remote controls, this LED is designed to deliver reliable and efficient operation. With a peak wavelength of 850nm and a maximum forward current of 0.1A, the SLR732A10 ensures optimal functionality. Trust Onsemi's expertise in semiconductor technology to bring you a superior lighting solution that will exceed your expectations. Upgrade your devices with the SLR732A10 and experience the difference today.

Feature Benefit Bullets

Maximum Forward Current: 0.1 A

This high maximum forward current allows for reliable and consistent performance of the infrared LEDs.

Peak Wavelength (nm): 850

The peak wavelength of 850 nm makes this product suitable for various applications such as remote controls, security systems, and industrial automation.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, these infrared LEDs can withstand high temperatures and operate efficiently in challenging environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C ensures that the infrared LEDs can also perform reliably in colder conditions.

Maximum Reverse Voltage: 3 V

The maximum reverse voltage of 3V adds a level of protection to the LEDs, preventing potential damages from reverse bias.

Semiconductor Material: GaAlAs

The use of GaAlAs semiconductor material in these infrared LEDs ensures higher efficiency and longer lifespan compared to other materials.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature makes it easy to install and secure the LEDs onto a circuit board, ensuring a stable connection for optimal performance.

Technical Specifications

Infrared LEDs SLR732A10 attributes and parameters. Explore more Infrared LEDs devices from Onsemi

Specs

Maximum Forward Current:

.1 A

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Peak Wavelength (nm):

850

Maximum Reverse Voltage:

3 V

Semiconductor Material:

GaAlAs

Sub-Category:

Infrared LEDs

Trade Compliance

SLR732A10 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20