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SFH487P

Infineon Technologies

SFH487P by Infineon Technologies

SFH487P by Infineon Tech is an Infrared LED with 0.1A max forward current, emitting at 880nm peak wavelength. Ideal for applications requiring fast response time, it operates b/w -55°C to 100°C with a viewing angle of 130°.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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ComSIT USA

USA . 46,873 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,800 parts In-Stock

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Vyrian

USA . 1,129 parts In-Stock

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Digiode

USA . 688 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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95

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

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$0.292

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86

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Aztec Data Supply Inc.

USA . 86 parts In-Stock

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$0.381

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86

$0.381

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Modulus Dynamics

Lithuania . 1,297 parts In-Stock

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$0.540

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$0.518

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$0.497

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1,297

$0.540

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Ampacity Inc.

Singapore . 764 parts In-Stock

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$1.100

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Semicontronic

India . 1,487 parts In-Stock

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$3.100

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$3.022

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$3.007

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1,487

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AZTECH Wire

Italy . 837 parts In-Stock

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$14.566

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Kepictronics

USA . 13,342 parts In-Stock

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Perfect Parts

USA . 11,415 parts In-Stock

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Continental Prestige Electronics

USA . 6,481 parts In-Stock

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Argo Parts USA

USA . 1,864 parts In-Stock

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Corphita

USA . 154 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock a world of possibilities with the SFH487P by Infineon Technologies. As a leading manufacturer in the industry, Infineon's Infrared LEDs are known for their reliability and performance. With a peak wavelength of 880nm and a maximum response time of 0.0000006s, this product is ideal for a wide range of applications. Whether you're looking to enhance security systems, improve remote control devices, or boost sensor functionality, the SFH487P offers unmatched quality and value. Experience the benefits of Infineon's advanced technology and take your projects to the next level with the SFH487P.

Feature Benefit Bullets

Maximum Forward Current: 0.1 A

The high maximum forward current allows for efficient operation and reliable performance.

Peak Wavelength (nm): 880

The peak wavelength of 880 nm ensures a strong signal transmission and accurate detection.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this product is suitable for a wide range of environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for use in cold conditions without compromising functionality.

Terminal Finish: Tin/Lead (Sn/Pb)

The use of tin/lead terminal finish ensures strong and durable connections for long-term use.

Maximum Response Time: 0.0000006 s

The extremely fast maximum response time of 0.0000006 seconds allows for quick and accurate sensing.

Maximum Reverse Voltage: 5 V

The maximum reverse voltage of 5 volts provides protection against potential damage from reverse polarity.

Semiconductor Material: GaAlAs

The use of GaAlAs semiconductor material ensures efficient energy conversion and reliable performance.

Viewing Angle: 130°

The wide viewing angle of 130° allows for versatile placement and coverage in applications.

Spectral Bandwidth: 80 m

The narrow spectral bandwidth of 80 m ensures precise detection and accurate results.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature allows for easy and secure installation in various devices.

Maximum Forward Voltage: 1.8 V

The low maximum forward voltage of 1.8 volts helps to conserve energy and reduce power consumption.

Technical Specifications

Infrared LEDs SFH487P attributes and parameters. Explore more Infrared LEDs devices from Infineon Technologies

Specs

Maximum Forward Current:

.1 A

Maximum Forward Voltage:

1.8 V

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Peak Wavelength (nm):

880

Maximum Response Time:

.0000006 s

Maximum Reverse Voltage:

5 V

Semiconductor Material:

GaAlAs

Spectral Bandwidth:

80 m

Sub-Category:

Infrared LEDs

Terminal Finish:

Viewing Angle:

130 deg

Trade Compliance

SFH487P Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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