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SFH485P

Infineon Technologies

SFH485P by Infineon Technologies

SFH485P by Infineon Technologies is an Infrared LED with peak wavelength of 880nm, forward current of 0.1A, and viewing angle of 80°. It operates b/w -55°C to 100°C, ideal for applications requiring fast response time such as proximity sensors and optical switches.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Digital Electronic Gebert Verwaltungs UG

Germany . 2,800 parts In-Stock

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Vyrian

USA . 670 parts In-Stock

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Digiode

USA . 554 parts In-Stock

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Zilex Electronics Inc.

Canada . 63 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 57 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Ampacity Inc.

Singapore . 278 parts In-Stock

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$0.100

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Modulus Dynamics

Lithuania . 7,356 parts In-Stock

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$0.430

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$0.413

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$0.396

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AZTECH Wire

Italy . 322 parts In-Stock

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Component Stockers USA

USA . 556 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

USA . 6,632 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 1,075 parts In-Stock

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Corphita

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Glotronic Ltd.

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Overview

Illuminate your world with the SFH485P Infrared LED by Infineon Technologies. Designed with precision and quality in mind, this powerful LED offers a peak wavelength of 880nm and a fast response time of 0.0000006s, making it ideal for various applications. Whether used in remote controls, security systems, or proximity sensors, the SFH485P delivers exceptional performance and reliability. Experience the value and benefits of this cutting-edge product, providing unmatched efficiency and versatility for all your lighting needs. Choose the SFH485P and see the difference that superior technology can make in your projects.

Feature Benefit Bullets

Maximum Forward Current: 0.1 A

Low forward current ensures energy efficiency and long lifespan of the LED.

Peak Wavelength (nm): 880

Optimal peak wavelength for infrared applications such as remote controls or security systems.

Maximum Operating Temperature: 100 °C

Can operate in high temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold temperatures making it suitable for various applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides a reliable connection and solderability for easy integration into circuits.

Maximum Response Time: 0.0000006 s

Ultra-fast response time for quick and accurate signal transmission.

Maximum Reverse Voltage: 5 V

Provides protection against reverse voltage to prevent damage to the LED.

Semiconductor Material: GaAlAs

High-quality semiconductor material for improved performance and durability.

Viewing Angle: 80°

Wide viewing angle allows for better coverage and detection in applications.

Spectral Bandwidth: 80 m

Narrow spectral bandwidth ensures accurate and precise emission of infrared light.

Mounting Feature: THROUGH HOLE MOUNT

Easy to mount on circuit boards for secure and stable installation.

Maximum Forward Voltage: 1.8 V

Low forward voltage ensures efficient power consumption and less heat generation.

Technical Specifications

Infrared LEDs SFH485P attributes and parameters. Explore more Infrared LEDs devices from Infineon Technologies

Specs

Maximum Forward Current:

.1 A

Maximum Forward Voltage:

1.8 V

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Peak Wavelength (nm):

880

Maximum Response Time:

.0000006 s

Maximum Reverse Voltage:

5 V

Semiconductor Material:

GaAlAs

Spectral Bandwidth:

80 m

Sub-Category:

Infrared LEDs

Terminal Finish:

Viewing Angle:

80 deg

Trade Compliance

SFH485P Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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