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SLR732AV60

Onsemi

SLR732AV60 by Onsemi

SLR732AV60 by Onsemi is an Infrared LED with 0.1A max forward current, 850nm peak wavelength, and 80 °C max operating temp. Ideal for applications requiring IR illumination in a 20° viewing angle.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,248 parts In-Stock

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Digiode

USA . 261 parts In-Stock

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Kulean Microsystems

USA . 6,910 parts In-Stock

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SupplyDigital Components

Austria . 3,039 parts In-Stock

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Problanco Electronics

Mexico . 2,755 parts In-Stock

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TANS Electronics

Latvia . 2,555 parts In-Stock

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Corphita

USA . 899 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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UHIMA Technologies

Türkiye . 23 parts In-Stock

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Overview

Illuminate your world with the Onsemi SLR732AV60 Infrared LED. Crafted by a trusted manufacturer, this high-quality component offers peak performance at an unbeatable value. Ideal for applications such as remote controls, security systems, and proximity sensors, this LED delivers superior brightness and efficiency. Experience the advantages of Onsemi technology and elevate your projects to new heights with the SLR732AV60.

Feature Benefit Bullets

Maximum Forward Current: 0.1 A

With a high maximum forward current, this product can handle a good amount of power, making it suitable for various applications requiring high intensity infrared illumination.

Peak Wavelength (nm): 850

The peak wavelength of 850nm indicates that this infrared LED is optimized for efficient transmission of infrared signals, making it ideal for use in remote controls, security systems, and other infrared communication devices.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature of 80 °C ensures that this product can withstand heat and operate efficiently even in challenging environments, increasing its reliability and longevity.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature of -25 °C, this product can function effectively in cold conditions, making it versatile for use in various indoor and outdoor applications.

Maximum Reverse Voltage: 3 V

The maximum reverse voltage of 3V provides protection against reverse polarity, ensuring the longevity and reliability of the LED by preventing damage from incorrect wiring.

Viewing Angle: 20°

The wide 20° viewing angle offers a broad coverage area for the emitted infrared light, which is beneficial for applications requiring a large area to be illuminated or sensed.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature makes it easy to securely install the LED onto circuit boards or other surfaces, providing a stable and reliable connection for seamless integration into electronic devices.

Maximum Forward Voltage: 1.6 V

The low maximum forward voltage of 1.6V ensures energy efficiency and helps minimize power consumption, making this product an environmentally friendly and cost-effective choice for infrared lighting applications.

Technical Specifications

Infrared LEDs SLR732AV60 attributes and parameters. Explore more Infrared LEDs devices from Onsemi

Specs

Maximum Forward Current:

.1 A

Maximum Forward Voltage:

1.6 V

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Peak Wavelength (nm):

850

Maximum Reverse Voltage:

3 V

Sub-Category:

Infrared LEDs

Viewing Angle:

20 deg

Trade Compliance

SLR732AV60 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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