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HSM8-C380

Broadcom

HSM8-C380 by Broadcom

INFRARED LED; Mounting Feature: SURFACE MOUNT; Packing Method: TR, 7 INCH; Maximum Forward Voltage: 1.7 V; Minimum Operating Temperature: -40 Cel; Configuration: SINGLE;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 3,994 parts In-Stock

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3,994

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Dan-Mar Components

USA . 3,994 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,994 parts In-Stock

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Digiode

USA . 392 parts In-Stock

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392

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Vyrian

USA . 378 parts In-Stock

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378

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,165 parts In-Stock

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$0.100

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$0.100

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Decca Corp

Germany . 766 parts In-Stock

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$5.000

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$4.900

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$4.851

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766

$5.000

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$4.851

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AZTECH Wire

Italy . 1,051 parts In-Stock

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$14.960

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1,051

$14.960

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Supply Digital

USA . 1,983 parts In-Stock

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Corphita

USA . 413 parts In-Stock

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Technical Specifications

Infrared LEDs HSM8-C380 attributes and parameters. Explore more Infrared LEDs devices from Broadcom

Specs

Configuration:

SINGLE

Maximum Forward Current:

.07 A

Maximum Forward Voltage:

1.7 V

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 7 INCH

Peak Wavelength (nm):

850

Shape:

ROUND

Size:

1.4 mm

Viewing Angle:

20 deg

Trade Compliance

HSM8-C380 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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