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HSM8-C350

Broadcom

HSM8-C350 by Broadcom

INFRARED LED; Mounting Feature: SURFACE MOUNT; Packing Method: TR, 7 INCH; Maximum Operating Temperature: 85 Cel; Shape: ROUND; Maximum Forward Current: .07 A;

Median Price

$0.640

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

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$0.640

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Vyrian

USA . 498 parts In-Stock

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$0.640

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498

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Bristol Electronics

USA . 14,983 parts In-Stock

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$1.210

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$0.992

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Dan-Mar Components

USA . 14,983 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Flip Electronics

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Digiode

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Distributors (Availability)

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Decca Corp

Germany . 2,889 parts In-Stock

1+ parts

$0.540

100+ parts

$0.529

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$0.524

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2,889

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Supply Digital

USA . 593 parts In-Stock

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Corphita

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Technical Specifications

Infrared LEDs HSM8-C350 attributes and parameters. Explore more Infrared LEDs devices from Broadcom

Specs

Configuration:

SINGLE

Maximum Forward Current:

.07 A

Maximum Forward Voltage:

1.8 V

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 7 INCH

Peak Wavelength (nm):

850

Shape:

ROUND

Viewing Angle:

80 deg

Trade Compliance

HSM8-C350 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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