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SGL160N60UF

Onsemi

SGL160N60UF by Onsemi

SGL160N60UF by Onsemi is an N-CHANNEL IGBT transistor with 600V VCE, 160A IC, and 2.6V VCEsat. Ideal for MOTOR CONTROL applications due to its 250W power dissipation, -55 to 150 °C operating temp range, and fast switching times of 150ns ton and 262ns toff.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Vyrian

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Digiode

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Nova Conductors

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ABC Electronics Ltd.

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Ampacity Inc.

Singapore . 273 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Corphita

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UHIMA Technologies

Türkiye . 561 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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TANS Electronics

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Overview

Enhance your motor control applications with the SGL160N60UF by Onsemi. This high-quality N-CHANNEL IGBT offers superior performance and reliability in a SINGLE configuration, making it ideal for various industrial uses. With a maximum collector-emitter voltage of 600V and a maximum collector current of 160A, this transistor ensures efficient power management. Trust Onsemi's expertise in semiconductor manufacturing to deliver value and benefits to your projects with the SGL160N60UF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop compared to P-CHANNEL, making them more efficient for motor control applications.

Maximum VCEsat: 2.6 V

Low VCEsat indicates low power loss during operation, leading to higher efficiency and reduced heat generation.

Maximum Power Dissipation (Abs): 250 W

The high power dissipation capability allows for handling heavy load conditions without the risk of overheating.

Maximum Collector-Emitter Voltage: 600 V

The high VCE voltage rating enables the IGBT to be used in applications where higher voltages are required for motor control.

Maximum Collector Current (IC): 160 A

With a high collector current rating, this IGBT can handle large current flows required for driving motors with high power requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGL160N60UF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

250 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-264AA

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

450 ns

Nominal Turn Off Time (toff):

262 ns

Nominal Turn On Time (ton):

150 ns

Maximum VCEsat:

2.6 V

Trade Compliance

SGL160N60UF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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