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NXH350N100H4Q2F2PG

Onsemi

NXH350N100H4Q2F2PG by Onsemi

NXH350N100H4Q2F2PG by Onsemi is an N-CHANNEL IGBT with 2 banks, series connected, and built-in diode. It has a max VCEsat of 1.8V and can handle up to 329A collector current. Ideal for power control applications due to its high power dissipation of 592W and operating temperature range from -40 °C to 125°C.

Median Price

$187.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

$256.860

100+ parts

$241.450

1k+ parts

$226.040

10k+ parts

-

15

$256.860

$241.450

$226.040

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DigiKey

USA . 8,027 parts In-Stock

1+ parts

-

100+ parts

$118.540

1k+ parts

$118.540

10k+ parts

$118.540

8,027

-

$118.540

$118.540

$118.540

Flip Electronics (Authorized)

USA . 8,027 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

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8,027

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Distributors (In-Stock)

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Vyrian

USA . 1,308 parts In-Stock

1+ parts

$118.540

100+ parts

-

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1,308

$118.540

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Digiode

USA . 1,245 parts In-Stock

1+ parts

$284.050

100+ parts

-

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10k+ parts

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1,245

$284.050

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-

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Flip Electronics

USA . 8,027 parts In-Stock

1+ parts

-

100+ parts

-

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8,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 459 parts In-Stock

1+ parts

$118.540

100+ parts

-

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459

$118.540

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-

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Microchip USA

USA . 455 parts In-Stock

1+ parts

$204.470

100+ parts

-

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455

$204.470

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Corphita

USA . 2,253 parts In-Stock

1+ parts

$269.100

100+ parts

-

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2,253

$269.100

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QUARKTWIN TECHNOLOGY LTD

USA . 27,780 parts In-Stock

1+ parts

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27,780

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Problanco Electronics

Mexico . 7,355 parts In-Stock

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7,355

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TANS Electronics

Latvia . 6,579 parts In-Stock

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6,579

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SupplyDigital Components

Austria . 4,453 parts In-Stock

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4,453

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Kulean Microsystems

USA . 2,280 parts In-Stock

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2,280

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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873

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Overview

Experience the power of innovation with the NXH350N100H4Q2F2PG by Onsemi, a leading manufacturer in the industry. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and performance for power control applications. With 2 banks, series connected, center tapped design, built-in diode, and thermistor, this transistor provides maximum efficiency and reliability. From its fast turn-off time to high collector current capacity, this product delivers exceptional value and benefits to customers seeking superior power management solutions. Upgrade your systems with the NXH350N100H4Q2F2PG and experience the difference in performance and durability.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have better performance and efficiency compared to P-Channel IGBTs, making this product suitable for high-power applications.

Configuration: 2 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This complex configuration allows for efficient power control and protection features, making it ideal for demanding applications where reliability is key.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in controlling high power loads.

Maximum VCEsat: 1.8 V

Low VCEsat helps in reducing power losses and improving efficiency, making this IGBT suitable for high-efficiency power conversion applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation, making it convenient for integration into various systems.

Nominal Turn Off Time (toff): 572.5 ns

Fast turn-off time helps in reducing switching losses and improving overall system efficiency, making this IGBT suitable for high-frequency applications.

Maximum Power Dissipation (Abs): 592 W

High power dissipation capability enables this IGBT to handle large amounts of power, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and heat dissipation, making it suitable for applications where thermal management is important.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in demanding environments, making this IGBT suitable for industrial applications.

Maximum Collector-Emitter Voltage: 1000 V

High collector-emitter voltage rating allows this IGBT to handle high voltage levels, making it suitable for high voltage applications.

Transistor Element Material: SILICON

Silicon-based construction provides good thermal and electrical properties, ensuring reliability and performance in a wide range of operating conditions.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating ensures reliable and safe operation, making this IGBT suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows this IGBT to function in extreme temperature conditions, making it suitable for outdoor or automotive applications.

Maximum Collector Current (IC): 329 A

High collector current rating allows this IGBT to handle large electrical currents, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Low gate-emitter threshold voltage ensures easy and reliable switching, making this IGBT suitable for applications requiring fast response times.

Terminal Position: UPPER

Upper terminal position allows for easy integration into existing systems, providing flexibility in design and installation.

Case Connection: ISOLATED

Isolated case connection provides electrical insulation, improving safety and reliability in high voltage applications.

Nominal Turn On Time (ton): 114 ns

Fast turn-on time enables quick response and switching, making this IGBT suitable for applications requiring precise control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH350N100H4Q2F2PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X42

No. of Elements:

2

No. of Terminals:

42

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

572.5 ns

Nominal Turn On Time (ton):

114 ns

Maximum VCEsat:

1.8 V

Trade Compliance

NXH350N100H4Q2F2PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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