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NXH300B100H4Q2F2PG

Onsemi

NXH300B100H4Q2F2PG by Onsemi

NXH300B100H4Q2F2PG by Onsemi is an N-CHANNEL IGBT with 6 elements, VCEsat of 2.25V, and IC of 73A. Ideal for POWER CONTROL applications, it has a toff of 326ns and ton of 110.42ns. Operating temperature ranges from -40 °C to 175°C, making it suitable for high-power systems.

Median Price

$149.380

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 36 parts In-Stock

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$147.844

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$79.070

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$147.844

$79.070

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Farnell

UK . 26 parts In-Stock

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$149.380

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$149.380

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DigiKey

USA . 36 parts In-Stock

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$151.270

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$135.063

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36

$151.270

$135.063

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Newark

USA . 36 parts In-Stock

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$155.810

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$139.110

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36

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$139.110

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Element14

Singapore . 26 parts In-Stock

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$230.620

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26

$230.620

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Future Electronics

Canada . 36 parts In-Stock

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$137.520

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Verical

USA . 36 parts In-Stock

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$79.070

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36

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$79.070

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Distributors (In-Stock)

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Digiode

USA . 776 parts In-Stock

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$135.080

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776

$135.080

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Vyrian

USA . 4,142 parts In-Stock

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NAC Semi

USA . 72 parts In-Stock

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$250.040

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$250.040

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Flip Electronics

USA . 72 parts In-Stock

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IBS Electronics

USA . 72 parts In-Stock

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$192.872

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72

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$192.872

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Distributors (Availability)

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$111.877

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147

$111.877

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Corphita

USA . 2,411 parts In-Stock

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$127.971

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Microchip USA

USA . 435 parts In-Stock

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$305.175

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435

$305.175

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Kulean Microsystems

USA . 7,617 parts In-Stock

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SupplyDigital Components

Austria . 6,653 parts In-Stock

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TANS Electronics

Latvia . 2,871 parts In-Stock

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Problanco Electronics

Mexico . 1,257 parts In-Stock

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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Overview

Unlock the power of advanced technology with the NXH300B100H4Q2F2PG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance in power control applications, providing customers with unparalleled efficiency and precision. With its N-CHANNEL polarity and complex configuration, this product delivers superior results while maximizing power dissipation. Trust Onsemi to deliver cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Maximum VCEsat: 2.25 V

Low VCEsat helps in reducing power dissipation and improving overall efficiency of the IGBT.

Maximum Power Dissipation (Abs): 194 W

High power dissipation capability allows the IGBT to handle high power applications without overheating.

Maximum Collector-Emitter Voltage: 1000 V

High collector-emitter voltage rating allows the IGBT to be used in high voltage circuits or systems.

Maximum Gate-Emitter Voltage: 20 V

The higher gate-emitter voltage rating provides robustness and reliability to the IGBT during switching operations.

Nominal Turn On Time (ton): 110.42 ns

Low turn-on time helps in fast switching speeds, which is crucial for power control applications where rapid switching is required.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH300B100H4Q2F2PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.9 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X59

No. of Elements:

6

No. of Terminals:

59

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

326 ns

Nominal Turn On Time (ton):

110.42 ns

Maximum VCEsat:

2.25 V

Trade Compliance

NXH300B100H4Q2F2PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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