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NXH300B100H4Q2F2SG

Onsemi

NXH300B100H4Q2F2SG by Onsemi

NXH300B100H4Q2F2SG by Onsemi is an N-CHANNEL IGBT with 6 elements, VCEsat of 2.25V, and IC of 73A. Ideal for POWER CONTROL applications, it has a toff of 326ns, ton of 110.42ns, and can handle up to 194W power dissipation.

Median Price

$138.440

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,883 parts In-Stock

1+ parts

$116.420

100+ parts

$109.430

1k+ parts

$102.450

10k+ parts

-

2,883

$116.420

$109.430

$102.450

-

Farnell

UK . 26 parts In-Stock

1+ parts

$128.630

100+ parts

-

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-

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26

$128.630

-

-

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Arrow

USA . 36 parts In-Stock

1+ parts

$133.180

100+ parts

$23.820

1k+ parts

-

10k+ parts

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36

$133.180

$23.820

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-

DigiKey

USA . 36 parts In-Stock

1+ parts

$138.440

100+ parts

$121.667

1k+ parts

-

10k+ parts

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36

$138.440

$121.667

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Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$139.050

100+ parts

-

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36

$139.050

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-

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Newark

USA . 36 parts In-Stock

1+ parts

$142.590

100+ parts

$125.320

1k+ parts

-

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36

$142.590

$125.320

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Element14

Singapore . 26 parts In-Stock

1+ parts

$205.240

100+ parts

-

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26

$205.240

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-

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Verical

USA . 2,883 parts In-Stock

1+ parts

-

100+ parts

$136.787

1k+ parts

$128.063

10k+ parts

-

2,883

-

$136.787

$128.063

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Chip1Stop

Japan . 36 parts In-Stock

1+ parts

-

100+ parts

$143.000

1k+ parts

-

10k+ parts

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36

-

$143.000

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,487 parts In-Stock

1+ parts

$126.464

100+ parts

-

1k+ parts

-

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1,487

$126.464

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-

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Vyrian

USA . 4,121 parts In-Stock

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4,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 302 parts In-Stock

1+ parts

$119.808

100+ parts

-

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-

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302

$119.808

-

-

-

Corohmni

South Africa . 352 parts In-Stock

1+ parts

$143.000

100+ parts

-

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352

$143.000

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Continental Prestige Electronics

USA . 36 parts In-Stock

1+ parts

$181.490

100+ parts

-

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36

$181.490

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Microchip USA

USA . 7,226 parts In-Stock

1+ parts

$307.125

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7,226

$307.125

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Kulean Microsystems

USA . 6,117 parts In-Stock

1+ parts

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6,117

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TANS Electronics

Latvia . 4,294 parts In-Stock

1+ parts

-

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4,294

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Problanco Electronics

Mexico . 2,232 parts In-Stock

1+ parts

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2,232

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SupplyDigital Components

Austria . 1,262 parts In-Stock

1+ parts

-

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1,262

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UHIMA Technologies

Türkiye . 887 parts In-Stock

1+ parts

-

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887

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Overview

Experience unparalleled power control with the NXH300B100H4Q2F2SG Insulated Gate Bipolar Transistor from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This N-CHANNEL transistor offers superior performance for a wide range of applications, making it an ideal choice for power control needs. With a maximum VCEsat of 2.25V and a maximum collector-emitter voltage of 1000V, this transistor is designed to handle high-power requirements with ease. Trust Onsemi to provide you with the best-in-class components for all your power control solutions.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower ON-state losses, higher power density, and faster switching speed compared to P-CHANNEL IGBTs, making them more efficient for power control applications.

Maximum VCEsat: 2.25 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction when the transistor is in the ON state, resulting in lower power dissipation and higher efficiency.

No. of Elements: 6

Having multiple elements allows for higher current handling capability and better power distribution, making this IGBT suitable for high-power applications.

Maximum Power Dissipation (Abs): 194 W

High power dissipation capability allows this IGBT to handle large amounts of power without getting damaged, making it reliable for power control applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures, ensuring stable performance under harsh operating conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH300B100H4Q2F2SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.9 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X59

No. of Elements:

6

No. of Terminals:

59

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

326 ns

Nominal Turn On Time (ton):

110.42 ns

Maximum VCEsat:

2.25 V

Trade Compliance

NXH300B100H4Q2F2SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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