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NXH040F120MNF1PTG

Onsemi

NXH040F120MNF1PTG by Onsemi

NXH040F120MNF1PTG by Onsemi is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a BRIDGE configuration with 4 elements, it has a max IDM of 90A and 0.056 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this FET utilizes SILICON CARBIDE technology and can handle temperatures from -40 to 175 °C.

Median Price

$82.672

Lifecycle Status

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Future Electronics

Canada . 9 parts In-Stock

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$81.080

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$77.220

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Arrow

USA . 3 parts In-Stock

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$82.413

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$49.280

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Newark

USA . 28 parts In-Stock

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$82.930

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$71.520

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Mouser Electronics

USA . 28 parts In-Stock

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$92.490

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DigiKey

USA . 25 parts In-Stock

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$92.490

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$75.288

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EBV Elektronik

Germany . 672 parts In-Stock

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Verical

USA . 56 parts In-Stock

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$49.280

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Digiode

USA . 867 parts In-Stock

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$115.558

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Nova Conductors

Japan . 50 parts In-Stock

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$118.880

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$118.880

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IBS Electronics

USA . 37 parts In-Stock

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$144.878

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$99.381

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Vyrian

USA . 5,286 parts In-Stock

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NAC Semi

USA . 532 parts In-Stock

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$161.130

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Flip Electronics

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AZTECH Wire

Italy . 829 parts In-Stock

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$11.382

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Semicontronic

India . 237 parts In-Stock

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$98.220

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$95.764

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$95.273

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$95.273

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Ampacity Inc.

Singapore . 43 parts In-Stock

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$98.220

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Corphita

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Corohmni

South Africa . 109 parts In-Stock

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Continental Prestige Electronics

USA . 6,243 parts In-Stock

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$118.880

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Microchip USA

USA . 276 parts In-Stock

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Problanco Electronics

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TANS Electronics

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SupplyDigital Components

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Netroflash

USA . 2,000 parts In-Stock

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$112.936

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$110.558

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Argo Parts USA

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Kulean Microsystems

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UHIMA Technologies

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Overview

Discover the NXH040F120MNF1PTG by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor designed for switching applications. With its innovative BRIDGE configuration, built-in diode, and thermistor, this transistor offers unparalleled performance and reliability. From its impressive 1200V breakdown voltage to its efficient 4-element design, this product stands out in the market. Whether you're looking to enhance your power management systems or boost efficiency, the NXH040F120MNF1PTG delivers exceptional value and benefits that cater to a wide range of customer needs. Experience the advantages of Onsemi's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - N-channel FETs offer high efficiency and fast switching speeds, making them ideal for power applications.

Configuration:

BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR - This configuration simplifies circuit design and provides added functionality for various applications.

Transistor Application:

SWITCHING - Designed specifically for switching applications, ensuring reliable performance in power control circuits.

Minimum DS Breakdown Voltage:

1200 V - A high breakdown voltage provides superior protection against voltage spikes and ensures safe operation in high voltage systems.

Package Shape:

RECTANGULAR - Rectangular packages are easy to mount and facilitate efficient heat dissipation for improved performance.

Operating Mode:

ENHANCEMENT MODE - Enhancement mode transistors offer low ON resistance and high switching speeds, enhancing overall circuit efficiency.

No. of Elements:

4 - Having 4 elements allows for greater control and flexibility in power management applications.

Maximum Pulsed Drain Current (IDM):

90 A - High pulsed drain current capability ensures efficient power handling in transient conditions.

No. of Terminals:

22 - The higher number of terminals provides more connectivity options and flexibility in circuit design.

Maximum Power Dissipation (Abs):

74 W - The high power dissipation capability allows for reliable operation under heavy loads.

Package Style (Meter):

FLANGE MOUNT - Flange mount packages offer easy installation and provide mechanical stability in various applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - MOS technology provides high input impedance and low power consumption for energy-efficient operation.

Maximum Operating Temperature:

175 °C - The high operating temperature range enables the FET to perform reliably in harsh environments.

Transistor Element Material:

SILICON CARBIDE - Silicon carbide offers superior thermal conductivity and high breakdown voltage, enhancing overall device reliability.

Minimum Operating Temperature:

40 °C - The wide temperature range ensures stable performance in extreme conditions.

Maximum Drain Current (ID):

30 A - High drain current capability allows for efficient power handling in continuous operation.

Maximum Drain-Source On Resistance:

0.056 ohm - Low ON resistance minimizes power loss and improves efficiency in power control applications.

Terminal Position:

UPPER - Upper terminal positioning facilitates easy connections and simplifies circuit layout.

Case Connection:

ISOLATED - Isolated case connection enhances safety by preventing electrical interference and reducing the risk of short circuits.

Maximum Feedback Capacitance (Crss):

12 pF - Low feedback capacitance ensures minimal signal distortion and stable operation in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NXH040F120MNF1PTG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-XUFM-X22

No. of Elements:

4

No. of Terminals:

22

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NXH040F120MNF1PTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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