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NXH040P120MNF1PG

Onsemi

NXH040P120MNF1PG by Onsemi

NXH040P120MNF1PG by Onsemi is an N-CHANNEL FET with 1200V DS breakdown voltage and 74A IDM. Ideal for switching applications, it features a package style of FLANGE MOUNT, operating temperature range of -40 to 175 °C, and 0.056 ohm max drain-source resistance.

Median Price

$66.880

Lifecycle Status

Suppliers In-Stock

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Future Electronics

Canada . 1 parts In-Stock

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DigiKey

USA . 26 parts In-Stock

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Digiode

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Vyrian

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Corphita

USA . 1,611 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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Microchip USA

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Overview

Power up your next project with the NXH040P120MNF1PG by Onsemi, a top-of-the-line Power Field Effect Transistor that offers unrivaled performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET is designed for high-efficiency switching applications, making it perfect for a wide range of electronic devices. With its advanced technology and impressive specifications, the NXH040P120MNF1PG delivers superior power handling capabilities and increased thermal performance, ensuring that your designs operate at peak efficiency. Trust Onsemi to provide you with quality components that bring value and innovation to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistances and higher switching speeds, making them ideal for high-frequency switching applications.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage allows this FET to be used in high-voltage applications, ensuring reliability and safety.

Maximum Pulsed Drain Current (IDM): 74 A

With a high pulsed drain current rating, this FET can handle short-duration high-current loads without damage, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 74 W

The high power dissipation rating ensures that this FET can handle significant power without overheating, making it reliable in high-power applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows this FET to be used in environments with elevated temperatures, ensuring reliability in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) NXH040P120MNF1PG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-XUFM-X18

No. of Elements:

2

No. of Terminals:

18

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

74 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NXH040P120MNF1PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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