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NXH027B120MNF2P2TG

Onsemi

NXH027B120MNF2P2TG by Onsemi

NXH027B120MNF2P2TG by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, 84A ID, and 0.038 ohm RDS. It is used for SWITCHING applications in power systems. Operating from -40 to 150 °C, it features METAL-OXIDE SEMICONDUCTOR tech and SILICON CARBIDE material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,337 parts In-Stock

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Digiode

USA . 2,025 parts In-Stock

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SupplyDigital Components

Austria . 7,854 parts In-Stock

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TANS Electronics

Latvia . 7,358 parts In-Stock

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Problanco Electronics

Mexico . 6,408 parts In-Stock

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Kulean Microsystems

USA . 4,170 parts In-Stock

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UHIMA Technologies

Türkiye . 961 parts In-Stock

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Corphita

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Corohmni

South Africa . 137 parts In-Stock

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Overview

Power up your applications with the NXH027B120MNF2P2TG by Onsemi. This N-CHANNEL Power Field Effect Transistor offers unparalleled quality and reliability, thanks to Onsemi's expertise in semiconductor technology. Ideal for switching applications, this transistor provides a high breakdown voltage of 1200V and a maximum drain current of 84A, ensuring optimal performance. With a maximum power dissipation of 134W and operating temperature range of -40 to 150 °C, this transistor delivers exceptional value and efficiency. Upgrade your projects with the NXH027B120MNF2P2TG and experience the advantages of cutting-edge technology from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high power applications and offer lower ON-state resistance, making them more efficient.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage of 1200 V allows this FET to be used in high voltage applications without the risk of failure.

Maximum Drain Current (Abs) (ID): 84 A

With a maximum drain current of 84 A, this FET can handle high current loads, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 134 W

The high power dissipation of 134 W ensures that this FET can handle high power levels without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate in high temperature environments without degrading performance.

Technical Specifications

Power Field Effect Transistors (FET) NXH027B120MNF2P2TG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

84 A

Maximum Drain Current (ID):

84 A

Maximum Drain-Source On Resistance:

.038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X23

No. of Elements:

3

No. of Terminals:

23

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NXH027B120MNF2P2TG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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