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NXH020F120MNF1PTG

Onsemi

NXH020F120MNF1PTG by Onsemi

NXH020F120MNF1PTG by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, 153A IDM, and 0.03 ohm RDS(on). Ideal for SWITCHING applications, it features a BRIDGE configuration with 4 elements, SILICON CARBIDE material, and operates b/w -40 to 175 °C.

Median Price

$148.916

Lifecycle Status

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12

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1k+

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Farnell

UK . 28 parts In-Stock

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$129.100

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Newark

USA . 28 parts In-Stock

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$144.070

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$131.470

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Arrow

USA . 3 parts In-Stock

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$153.762

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$91.940

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DigiKey

USA . 28 parts In-Stock

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$156.400

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$140.468

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Mouser Electronics

USA . 28 parts In-Stock

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$167.870

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EBV Elektronik

Germany . 336 parts In-Stock

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Verical

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$91.940

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Digiode

USA . 2,067 parts In-Stock

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$118.208

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IBS Electronics

USA . 9 parts In-Stock

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$216.237

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$200.600

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NAC Semi

USA . 280 parts In-Stock

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$300.620

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$273.290

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Vyrian

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Flip Electronics

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Corphita

USA . 767 parts In-Stock

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$111.987

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Corohmni

South Africa . 191 parts In-Stock

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Microchip USA

USA . 9,769 parts In-Stock

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SupplyDigital Components

Austria . 7,523 parts In-Stock

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Problanco Electronics

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TANS Electronics

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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Overview

Discover the NXH020F120MNF1PTG by Onsemi, a high-quality power Field Effect Transistor that offers reliability and efficiency. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL transistor is perfect for switching applications. With its built-in diode and thermistor, this transistor provides added convenience and performance. Experience seamless operation with an enhancement mode configuration and a maximum pulsed drain current of 153 A. Trust in Onsemi's expertise and elevate your projects with the NXH020F120MNF1PTG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer higher mobility and lower resistance compared to P-CHANNEL FETs, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage allows for reliable operation in high voltage environments, making this FET suitable for power applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor simplify circuit design and improve efficiency by providing protection and temperature sensing capabilities.

Maximum Pulsed Drain Current (IDM): 153 A

The high pulsed drain current capability allows for handling sudden surges in current, making this FET ideal for high-power switching applications.

Maximum Power Dissipation (Abs): 119 W

The high power dissipation capability enables the FET to handle significant power levels without overheating, ensuring reliable performance in demanding environments.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for reliable operation in a variety of environments, making this FET versatile and suitable for different applications.

Technical Specifications

Power Field Effect Transistors (FET) NXH020F120MNF1PTG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

51 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

19 pF

JESD-30 Code:

R-XUFM-X22

No. of Elements:

4

No. of Terminals:

22

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

153 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NXH020F120MNF1PTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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