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NVTFWS004N04CTAG

Onsemi

NVTFWS004N04CTAG by Onsemi

NVTFWS004N04CTAG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 338A IDM. Ideal for applications requiring high power dissipation, such as automotive systems. Operating in enhancement mode, it features a low 0.0049 ohm Drain-Source Resistance for efficient performance.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,500 parts In-Stock

1+ parts

$2.380

100+ parts

$1.045

1k+ parts

$0.836

10k+ parts

$0.669

1,500

$2.380

$1.045

$0.836

$0.669

Distributors (In-Stock)

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Flip Electronics

USA . 7,500 parts In-Stock

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-

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7,500

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Vyrian

USA . 4,715 parts In-Stock

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4,715

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Digiode

USA . 1,655 parts In-Stock

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1,655

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Distributors (Availability)

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Component Stockers USA

USA . 14,260 parts In-Stock

1+ parts

$9.510

100+ parts

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14,260

$9.510

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AZTECH Wire

Italy . 348 parts In-Stock

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$17.410

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348

$17.410

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,687 parts In-Stock

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Microchip USA

USA . 11,393 parts In-Stock

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11,393

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 5,312 parts In-Stock

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TANS Electronics

Latvia . 5,183 parts In-Stock

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Kulean Microsystems

USA . 4,847 parts In-Stock

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4,847

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SupplyDigital Components

Austria . 4,684 parts In-Stock

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4,684

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Corphita

USA . 1,371 parts In-Stock

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1,371

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UHIMA Technologies

Türkiye . 466 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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447

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Overview

Experience superior performance and reliability with the NVTFWS004N04CTAG Power Field Effect Transistor by Onsemi. This N-CHANNEL FET features a single configuration with a built-in diode, ensuring optimal efficiency in various applications. With a maximum drain current of 18 A and a low on-resistance of 0.0049 ohm, this transistor delivers exceptional power handling capabilities. Whether you're in automotive, industrial, or consumer electronics, this high-quality product offers unmatched value and benefits to meet your specific needs. Trust Onsemi for cutting-edge technology and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications, providing efficient switching and high current capability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse current flow protection, making the transistor suitable for applications where this feature is required.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage rating ensures the transistor can handle higher voltages, making it suitable for demanding power applications.

Maximum Pulsed Drain Current (IDM): 338 A

The high pulsed drain current rating indicates the transistor's capability to handle short-term power surges, making it ideal for high-current applications.

Maximum Power Dissipation (Abs): 55 W

The high power dissipation rating allows the transistor to operate efficiently without overheating, ensuring reliable performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFWS004N04CTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

122 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.0049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

338 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFWS004N04CTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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