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NVTFS5826NLWFTWG

Onsemi

NVTFS5826NLWFTWG by Onsemi

NVTFS5826NLWFTWG by Onsemi is a single N-channel Power FET with 20A max drain current and 22W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175°C, ideal for high-power applications in surface mount configurations.

Median Price

$0.514

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 68,900 parts In-Stock

1+ parts

-

100+ parts

$0.504

1k+ parts

$0.418

10k+ parts

$0.373

68,900

-

$0.504

$0.418

$0.373

Verical

USA . 68,900 parts In-Stock

1+ parts

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$0.523

10k+ parts

$0.466

68,900

-

-

$0.523

$0.466

Distributors (In-Stock)

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Flip Electronics

USA . 637,000 parts In-Stock

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637,000

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Chip Stock

USA . 31,580 parts In-Stock

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31,580

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Sensible Micro Corp

USA . 5,000 parts In-Stock

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Vyrian

USA . 4,426 parts In-Stock

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4,426

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Digiode

USA . 2,414 parts In-Stock

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Bristol Electronics

USA . 1,485 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

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$7.050

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1,029

$7.050

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AZTECH Wire

Italy . 578 parts In-Stock

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$14.700

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Infinite Electronics LLP (Excess)

. 360,013 parts In-Stock

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TANS Electronics

Latvia . 6,426 parts In-Stock

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Problanco Electronics

Mexico . 3,572 parts In-Stock

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SupplyDigital Components

Austria . 3,385 parts In-Stock

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Kepictronics

USA . 2,302 parts In-Stock

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Kulean Microsystems

USA . 2,256 parts In-Stock

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Corphita

USA . 403 parts In-Stock

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Corohmni

South Africa . 298 parts In-Stock

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UHIMA Technologies

Türkiye . 243 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the NVTFS5826NLWFTWG by Onsemi. Crafted with precision by a trusted manufacturer, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability. Whether it's in automotive, industrial, or consumer electronics applications, this single configuration surface mount transistor delivers unmatched efficiency and power management. Elevate your projects to new heights with the cutting-edge technology of the NVTFS5826NLWFTWG and experience the difference in quality, value, and performance that only Onsemi can provide.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - Provides efficient current flow in one direction, making it suitable for various applications.

Configuration

SINGLE - Simplifies circuit design and control, making it easier to use.

Surface Mount

YES - Enables easy installation and PCB assembly, saving time and effort.

Maximum Drain Current (Abs) (ID)

20 A - Capable of handling high current loads, ensuring reliable performance.

Maximum Power Dissipation (Abs)

22 W - Offers good power handling capability for various applications.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Provides efficient switching performance and low power consumption.

Maximum Operating Temperature

175 °C - Suitable for operating in various environmental conditions without overheating.

Terminal Finish

Matte Tin (Sn) - annealed - Enhances solderability and reliability of connections.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper reflow soldering without damaging the component.

Peak Reflow Temperature °C

260 - Compatible with standard reflow soldering processes for easy integration.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5826NLWFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVTFS5826NLWFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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