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NVTFS012P03P8ZTAG

Onsemi

NVTFS012P03P8ZTAG by Onsemi

NVTFS012P03P8ZTAG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, 47A IDM, and 0.02 ohm RDS(ON). Ideal for SWITCHING applications in automotive (AEC-Q101) and industrial sectors. Operating range from -55 to 175 °C with METAL-OXIDE SEMICONDUCTOR technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,587 parts In-Stock

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Digiode

USA . 1,319 parts In-Stock

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Component Stockers USA

USA . 25,989 parts In-Stock

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$3.530

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AZTECH Wire

Italy . 1,059 parts In-Stock

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$10.490

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Problanco Electronics

Mexico . 7,000 parts In-Stock

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TANS Electronics

Latvia . 4,448 parts In-Stock

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Kulean Microsystems

USA . 2,538 parts In-Stock

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SupplyDigital Components

Austria . 2,279 parts In-Stock

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Corphita

USA . 2,008 parts In-Stock

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Overview

Unlock the power of innovation with the NVTFS012P03P8ZTAG by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in every product they manufacture. This Power FET is perfect for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 47A and a minimum DS breakdown voltage of 30V, this transistor packs a punch while remaining compact and versatile. Trust Onsemi to provide you with cutting-edge technology that delivers results. Elevate your projects with the NVTFS012P03P8ZTAG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

Allows for efficient power management and control in applications where P-channel transistors are needed.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the transistor package, saving space and reducing component count.

Transistor Application: SWITCHING

Ideal for applications that require high-speed switching and efficient power control.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving assembly time and space.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, allowing the transistor to handle higher voltages without breakdown.

Maximum Pulsed Drain Current (IDM): 47 A

Capable of handling high current pulses for demanding applications.

Maximum Power Dissipation (Abs): 2.4 W

Can dissipate heat effectively, ensuring reliable operation under variable load conditions.

Maximum Operating Temperature: 175 °C

Suitable for use in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.02 ohm

Provides low on-resistance for efficient power switching and minimal power loss.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS012P03P8ZTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

506 pF

JESD-30 Code:

S-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

47 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVTFS012P03P8ZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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