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NVMFWS003P03P8ZT1G

Onsemi

NVMFWS003P03P8ZT1G by Onsemi

NVMFWS003P03P8ZT1G by Onsemi is a P-CHANNEL Power FET with 30V DS Breakdown Voltage and 900A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0018 ohm RDS(on), and operates in ENHANCEMENT MODE. AEC-Q101 compliant, it has a max power dissipation of 168.7W and can withstand up to 175 °C operating temperature.

Median Price

$3.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,466 parts In-Stock

1+ parts

$3.240

100+ parts

$1.469

1k+ parts

$1.194

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1,466

$3.240

$1.469

$1.194

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Distributors (In-Stock)

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Vyrian

USA . 4,341 parts In-Stock

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4,341

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Digiode

USA . 763 parts In-Stock

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763

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Microchip USA

USA . 3,769 parts In-Stock

1+ parts

$8.481

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3,769

$8.481

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AZTECH Wire

Italy . 901 parts In-Stock

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$18.480

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901

$18.480

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SupplyDigital Components

Austria . 7,640 parts In-Stock

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7,640

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TANS Electronics

Latvia . 7,315 parts In-Stock

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Kulean Microsystems

USA . 6,566 parts In-Stock

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Problanco Electronics

Mexico . 1,774 parts In-Stock

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1,774

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Corphita

USA . 1,364 parts In-Stock

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Corohmni

South Africa . 299 parts In-Stock

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UHIMA Technologies

Türkiye . 78 parts In-Stock

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Overview

Unlock a world of power and efficiency with the NVMFWS003P03P8ZT1G by Onsemi. Crafted with precision and reliability, this P-CHANNEL Power FET is engineered for superior performance in switching applications. Its single configuration with a built-in diode ensures seamless operation, while its small outline package guarantees versatility in various setups. With a maximum power dissipation of 168.7W and a minimum DS breakdown voltage of 30V, this transistor is a game-changer in the field of electronics. Elevate your projects with the NVMFWS003P03P8ZT1G and experience unparalleled quality and excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel transistors are required, offering flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Specifically designed for switching applications, delivering fast and efficient performance.

Surface Mount: YES

Ideal for automated assembly processes and compact PCB designs.

Minimum DS Breakdown Voltage: 30 V

Offers a reliable breakdown voltage level for various voltage requirements in electronic circuits.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit layouts and PCB designs.

Operating Mode: ENHANCEMENT MODE

Enhances control and efficiency in switching applications, improving overall performance.

Maximum Pulsed Drain Current (IDM): 900 A

Handles high current pulses, suitable for demanding applications with intermittent high loads.

Avalanche Energy Rating (EAS): 186 mJ

Provides protection against avalanche breakdown events, ensuring long-term reliability.

No. of Terminals: 6

Offers multiple connection points for various circuit configurations and applications.

Maximum Power Dissipation (Abs): 168.7 W

Capable of dissipating high power levels, ideal for applications with high power requirements.

Package Style (Meter): SMALL OUTLINE

Compact package design saves space on the PCB, suitable for miniaturized electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for efficient power handling and switching capabilities.

Maximum Operating Temperature: 175 °C

Suitable for operation in high-temperature environments, ensuring performance under challenging conditions.

Transistor Element Material: SILICON

Reliable and commonly used material for transistor construction, ensuring consistent performance.

Minimum Operating Temperature: -55 °C

Capable of functioning in cold temperatures, suitable for a wide range of operating conditions.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for reliable electrical connections.

Maximum Drain Current (ID): 234 A

Handles high continuous current, suitable for demanding applications with constant high loads.

Maximum Drain-Source On Resistance: 0.0018 ohm

Low ON resistance minimizes power loss and heat generation during operation.

Terminal Position: DUAL

Offers flexibility in circuit layout and connectivity options, accommodating various design requirements.

Case Connection: DRAIN

Provides a common connection point for the drain terminal, simplifying circuit design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 260

Suitable for high-temperature soldering processes, ensuring proper solder joint formation.

Maximum Feedback Capacitance (Crss): 4100 pF

Low feedback capacitance minimizes signal loss and interference, improving overall performance.

Reference Standard: AEC-Q101

Meets automotive industry standards for quality and reliability, suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFWS003P03P8ZT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

186 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

234 A

Maximum Drain-Source On Resistance:

.0018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4100 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVMFWS003P03P8ZT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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