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NVMFS6B14NLT1G

Onsemi

NVMFS6B14NLT1G by Onsemi

NVMFS6B14NLT1G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 140A IDM, and 0.019 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications due to AEC-Q101 compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,278 parts In-Stock

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Digiode

USA . 499 parts In-Stock

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499

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AZTECH Wire

Italy . 1,207 parts In-Stock

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$12.980

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Kulean Microsystems

USA . 8,176 parts In-Stock

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Problanco Electronics

Mexico . 7,613 parts In-Stock

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TANS Electronics

Latvia . 6,947 parts In-Stock

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SupplyDigital Components

Austria . 4,537 parts In-Stock

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Perfect Parts

USA . 3,506 parts In-Stock

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Corphita

USA . 1,406 parts In-Stock

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Corohmni

South Africa . 370 parts In-Stock

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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Overview

Experience the power and efficiency of the NVMFS6B14NLT1G Power Field Effect Transistor by Onsemi. Known for their high-quality components, Onsemi delivers reliable solutions for a variety of applications. This N-channel transistor with a built-in diode offers enhanced performance and durability, making it ideal for demanding projects. With a maximum pulsed drain current of 140 A and a minimum DS breakdown voltage of 100 V, this transistor provides exceptional value and benefits to customers looking for top-notch power management solutions. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage of 100V ensures that the transistor can handle higher voltages without damage, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 140 A

With a high pulsed drain current of 140A, this transistor is capable of handling large current spikes, making it ideal for high-power applications.

Avalanche Energy Rating (EAS): 29 mJ

The high avalanche energy rating of 29mJ means that the transistor can withstand energy surges without breakdown, ensuring reliability in harsh operating conditions.

Maximum Drain-Source On Resistance: 0.019 ohm

The low drain-source on resistance of 0.019 ohm results in minimal power loss and efficient operation, making this transistor suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B14NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

29 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

140 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B14NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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