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NVMFS6B05NLT1G

Onsemi

NVMFS6B05NLT1G by Onsemi

NVMFS6B05NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 100V DS breakdown voltage, and 330A pulsed drain current. Ideal for applications requiring high power dissipation in small outline packages like automotive electronics due to its 165W max power dissipation and AEC-Q101 reference standard compliance.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,432 parts In-Stock

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Digiode

USA . 2,280 parts In-Stock

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Flip Electronics

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AZTECH Wire

Italy . 368 parts In-Stock

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Component Stockers USA

USA . 679 parts In-Stock

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TANS Electronics

Latvia . 5,874 parts In-Stock

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SupplyDigital Components

Austria . 5,648 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Problanco Electronics

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Corphita

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Corohmni

South Africa . 489 parts In-Stock

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GreenTree Electronics

Israel . 420 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 193 parts In-Stock

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Overview

Unlock the power of innovation with the NVMFS6B05NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs that cater to a wide range of applications. With its N-channel configuration and built-in diode, this transistor offers unparalleled performance and reliability. Whether you're looking to enhance your electronic devices or optimize power management systems, this product is designed to exceed your expectations. Experience efficiency at its best with Onsemi's NVMFS6B05NLT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Polarity or Channel Type: N-CHANNEL

Efficient for certain types of circuit designs and applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces the need for additional components.

Surface Mount: YES

Facilitates easy and compact integration onto circuit boards.

Minimum DS Breakdown Voltage: 100 V

Suitable for applications requiring high voltage handling capabilities.

Maximum Pulsed Drain Current (IDM): 330 A

Capable of handling high current pulses for optimal performance.

Maximum Power Dissipation (Abs): 165 W

Can dissipate heat efficiently for continuous operation.

Maximum Operating Temperature: 175 °C

Operates reliably in high-temperature environments.

Maximum Drain-Source On Resistance: 0.0082 ohm

Provides low resistance for efficient power flow.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B05NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

114 A

Maximum Drain Current (ID):

114 A

Maximum Drain-Source On Resistance:

.0082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

330 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B05NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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