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NVMFS6B03NLT1G

Onsemi

NVMFS6B03NLT1G by Onsemi

NVMFS6B03NLT1G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 520A IDM, and 0.006 ohm RDS(ON). Widely used in power applications due to its 198W Pdiss, -55 to 175 °C operating range, and AEC-Q101 compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,711 parts In-Stock

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Digiode

USA . 1,119 parts In-Stock

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AZTECH Wire

Italy . 616 parts In-Stock

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$17.700

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Kulean Microsystems

USA . 8,136 parts In-Stock

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TANS Electronics

Latvia . 7,809 parts In-Stock

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SupplyDigital Components

Austria . 5,216 parts In-Stock

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Problanco Electronics

Mexico . 3,942 parts In-Stock

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UHIMA Technologies

Türkiye . 774 parts In-Stock

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Corphita

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Corohmni

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Overview

Unleash the power of innovation with the NVMFS6B03NLT1G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. Say goodbye to downtime and hello to increased efficiency with the NVMFS6B03NLT1G. Experience the benefits of enhanced mode operation and high power dissipation, making it the ideal choice for all your power management needs. Elevate your projects with Onsemi's cutting-edge technology and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection and durability for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse currents, enhancing the overall performance of the FET.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation of the FET in various electronic devices and systems.

Maximum Pulsed Drain Current (IDM): 520 A

With a high maximum pulsed drain current, this FET can handle high-load applications and deliver reliable performance under heavy loads.

Maximum Power Dissipation (Abs): 198 W

The high maximum power dissipation rating ensures that the FET can handle high power levels without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate effectively in demanding environments without the risk of overheating or performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B03NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

145 A

Maximum Drain Current (ID):

145 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

520 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B03NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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