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NVMFS5C682NLAFT1G

Onsemi

NVMFS5C682NLAFT1G by Onsemi

NVMFS5C682NLAFT1G by Onsemi is a power FET with N-channel configuration and a min DS breakdown voltage of 60V. It has a max pulsed drain current of 130A and an avalanche energy rating of 43mJ. This transistor is suitable for applications requiring high power dissipation and temperature resistance, such as automotive electronics or industrial equipment.

Median Price

$1.220

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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DigiKey

USA . 14,467 parts In-Stock

1+ parts

$1.220

100+ parts

$0.506

1k+ parts

$0.394

10k+ parts

$0.281

14,467

$1.220

$0.506

$0.394

$0.281

Mouser Electronics

USA . 340 parts In-Stock

1+ parts

$1.220

100+ parts

$0.507

1k+ parts

$0.375

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$0.338

340

$1.220

$0.507

$0.375

$0.338

Verical

USA . 9,000 parts In-Stock

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-

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$0.887

9,000

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$0.887

Distributors (In-Stock)

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Maritex

Poland . 1,177 parts In-Stock

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$0.780

100+ parts

$0.449

1k+ parts

$0.382

10k+ parts

$0.331

1,177

$0.780

$0.449

$0.382

$0.331

Digiode

USA . 1,587 parts In-Stock

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$0.884

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1,587

$0.884

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Chip Stock

USA . 76,700 parts In-Stock

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76,700

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IBS Electronics

USA . 12,000 parts In-Stock

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$0.856

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$0.856

NAC Semi

USA . 9,000 parts In-Stock

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$0.977

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Vyrian

USA . 6,306 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,452 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 6,501 parts In-Stock

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$0.230

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6,501

$0.230

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Corohmni

South Africa . 426 parts In-Stock

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$0.270

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426

$0.270

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Corphita

USA . 1,266 parts In-Stock

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$0.837

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1,266

$0.837

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Aztec Data Supply Inc.

USA . 246 parts In-Stock

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$1.099

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RC Electronics

USA . 84,665 parts In-Stock

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iodParts Technologies Inc.

India . 65,973 parts In-Stock

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Eastek

USA . 13,500 parts In-Stock

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$0.400

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13,500

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$0.400

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Lixinc

USA . 11,702 parts In-Stock

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Futuretech Components

Singapore . 10,500 parts In-Stock

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Perfect Parts

USA . 8,285 parts In-Stock

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Kulean Microsystems

USA . 7,832 parts In-Stock

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TANS Electronics

Latvia . 6,181 parts In-Stock

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Continental Prestige Electronics

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SupplyDigital Components

Austria . 3,609 parts In-Stock

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Kepictronics

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Argo Parts USA

USA . 2,467 parts In-Stock

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Aranea Global

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Problanco Electronics

Mexico . 919 parts In-Stock

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UHIMA Technologies

Türkiye . 659 parts In-Stock

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659

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Overview

Experience the power of innovation with the NVMFS5C682NLAFT1G by Onsemi. As a leading manufacturer in power field effect transistors, Onsemi brings you a product that delivers exceptional quality and unmatched performance. With its N-channel configuration and built-in diode, this transistor offers versatility and reliability like no other. Whether you're in the automotive industry or working on industrial applications, this transistor is designed to meet your needs. Boasting a minimum DS breakdown voltage of 60V and a maximum pulsed drain current of 130A, it guarantees efficient power management. Its small outline package and flat terminal form make installation a breeze. Trust Onsemi to provide you with a solution that exceeds expectations. Discover the NVMFS5C682NLAFT1G and unlock endless possibilities for your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good thermal and mechanical properties, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency, making them ideal for many power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection, enhancing the reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and compact integration on PCBs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures the FET can handle high voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and alignment on circuit boards, enhancing ease of use during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control over the switching operation, improving efficiency and performance.

Maximum Pulsed Drain Current (IDM): 130 A

The high pulsed drain current rating allows the FET to handle transient currents effectively, making it suitable for high-power pulse applications.

Avalanche Energy Rating (EAS): 43 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy spikes, improving overall robustness and reliability.

Maximum Drain Current (Abs) (ID): 25 A

The high maximum drain current rating allows the FET to handle continuous current without overheating, ensuring reliable performance.

No. of Terminals: 5

The 5-terminal configuration provides easy connectivity and flexibility in circuit design, allowing for versatile applications.

Maximum Power Dissipation (Abs): 28 W

The high power dissipation rating indicates the FET's ability to handle power without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it suitable for compact designs and applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, enhancing the efficiency of the FET.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures the FET can operate reliably in high-temperature environments without degrading performance.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, offering stable performance and durability in various operating conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature rating allows the FET to function in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability, ensuring reliable connections during assembly and improving overall product quality.

Maximum Drain Current (ID): 25 A

The high maximum drain current rating indicates the FET's ability to handle current without exceeding its limits, ensuring safe and reliable operation.

Maximum Drain-Source On Resistance: 0.0315 ohm

The low on-resistance of the FET allows for efficient current flow and minimal power loss, improving overall performance and efficiency.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and allows for easy integration into various setups, enhancing versatility.

Case Connection: DRAIN

The drain case connection simplifies the layout and design of the circuit, allowing for more efficient and compact setups.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum reflow time ensures quick and efficient soldering during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for reliable soldering of the FET onto PCBs, ensuring strong and durable connections.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that the FET meets stringent automotive industry requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C682NLAFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

43 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0315 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C682NLAFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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