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NVMFS5C645NWFT1G

Onsemi

NVMFS5C645NWFT1G by Onsemi

NVMFS5C645NWFT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 820A IDM, and 0.0046 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,500 parts In-Stock

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$1.920

100+ parts

$0.826

1k+ parts

$0.655

10k+ parts

$0.497

1,500

$1.920

$0.826

$0.655

$0.497

Mouser Electronics

USA . 1,350 parts In-Stock

1+ parts

$1.920

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$0.826

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$0.572

10k+ parts

$0.569

1,350

$1.920

$0.826

$0.572

$0.569

Arrow

USA . 1,500 parts In-Stock

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$0.506

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Future Electronics

Canada . 1,500 parts In-Stock

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$1.140

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Verical

USA . 1,500 parts In-Stock

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$0.506

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Vyrian

USA . 6,534 parts In-Stock

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NAC Semi

USA . 3,000 parts In-Stock

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$2.130

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Digiode

USA . 2,435 parts In-Stock

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IBS Electronics

USA . 1,500 parts In-Stock

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$1.599

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$1.599

Distributors (Availability)

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AZTECH Wire

Italy . 1,207 parts In-Stock

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$13.100

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Kulean Microsystems

USA . 6,694 parts In-Stock

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TANS Electronics

Latvia . 6,346 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,832 parts In-Stock

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Problanco Electronics

Mexico . 2,865 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 822 parts In-Stock

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Corohmni

South Africa . 373 parts In-Stock

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Overview

Enhance the performance of your power applications with the NVMFS5C645NWFT1G from Onsemi. This high-quality N-channel Power FET offers a single configuration with built-in diode, providing reliable and efficient power management solutions. Perfect for a variety of applications, this transistor delivers exceptional value with its high power dissipation rating and low drain-source resistance. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the NVMFS5C645NWFT1G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, ensuring good reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better conductivity and efficiency compared to P-channel transistors, making this product a good choice for high-performance applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this transistor can handle high voltages, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 820 A

The high pulsed drain current rating of 820 A allows this transistor to handle large current spikes efficiently, making it ideal for high-power applications.

Maximum Power Dissipation (Abs): 79 W

The high power dissipation rating of 79 W ensures that this transistor can handle power efficiently without overheating, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this transistor can operate in high-temperature environments without degradation, ensuring reliability.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C645NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

185 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

92 A

Maximum Drain Current (ID):

92 A

Maximum Drain-Source On Resistance:

.0046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

820 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C645NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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