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NVMFS5C456NLWFT3G

Onsemi

NVMFS5C456NLWFT3G by Onsemi

NVMFS5C456NLWFT3G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 520A IDM, and 0.006 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,714 parts In-Stock

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Digiode

USA . 1,598 parts In-Stock

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Microchip USA

USA . 180 parts In-Stock

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$3.354

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AZTECH Wire

Italy . 43 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,278 parts In-Stock

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TANS Electronics

Latvia . 5,766 parts In-Stock

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SupplyDigital Components

Austria . 4,202 parts In-Stock

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Corphita

USA . 2,255 parts In-Stock

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Problanco Electronics

Mexico . 678 parts In-Stock

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Kulean Microsystems

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Corohmni

South Africa . 233 parts In-Stock

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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Overview

Power up your projects with the NVMFS5C456NLWFT3G by Onsemi! This high-quality Power FET offers enhanced performance and reliability, making it ideal for a wide range of applications. With a maximum drain current of 87 A and a low on-resistance of 0.006 ohm, this transistor delivers exceptional power handling capabilities. Whether you're building automotive electronics, industrial controls, or renewable energy systems, this N-channel FET is guaranteed to optimize efficiency and boost overall performance. Trust Onsemi for cutting-edge technology and superior quality components that exceed industry standards.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can potentially reduce the overall component count and board space required.

Maximum Pulsed Drain Current (IDM): 520 A

A high pulsed drain current rating allows the FET to handle momentary high current spikes without damage, improving overall reliability in power applications.

Maximum Drain Current (ID): 87 A

The high drain current rating ensures that the FET can handle high continuous current flow, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 55 W

With a high power dissipation rating, this FET can effectively handle heat dissipation, enabling it to operate efficiently even under high load conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to withstand elevated temperatures without performance degradation, making it suitable for industrial and automotive applications.

Maximum Feedback Capacitance (Crss): 21 pF

Low feedback capacitance helps in minimizing signal distortion and improving the overall efficiency of the FET in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C456NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

202 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

87 A

Maximum Drain Current (ID):

87 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

21 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

520 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C456NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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