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NVMFS5C430NLWFT3G

Onsemi

NVMFS5C430NLWFT3G by Onsemi

NVMFS5C430NLWFT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0022 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications meeting AEC-Q101 standards.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 13,342 parts In-Stock

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Digiode

USA . 1,605 parts In-Stock

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Microchip USA

USA . 273 parts In-Stock

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$4.242

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AZTECH Wire

Italy . 958 parts In-Stock

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Kulean Microsystems

USA . 7,113 parts In-Stock

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SupplyDigital Components

Austria . 7,053 parts In-Stock

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TANS Electronics

Latvia . 3,597 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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UHIMA Technologies

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Problanco Electronics

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Corohmni

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Overview

Elevate your power management solutions with the NVMFS5C430NLWFT3G by Onsemi. Crafted with precision and quality, this N-channel power field effect transistor offers unparalleled performance and reliability. With a single configuration featuring a built-in diode, this surface mount device is perfect for a wide range of applications. Experience enhanced efficiency and power handling capabilities with this innovative product. Trust in Onsemi's expertise in semiconductor technology to deliver the value and benefits you need for your projects. Choose the NVMFS5C430NLWFT3G for superior power control and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency compared to P-channel FETs, making this product a good choice for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect against reverse voltage and ensures safe operation of the FET in various circuit configurations.

Surface Mount: YES

Being surface mountable makes the FET suitable for automated assembly processes, saving time and effort in manufacturing.

Minimum DS Breakdown Voltage: 40 V

Having a minimum breakdown voltage of 40V ensures that the FET can handle higher voltage loads without failure.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards and optimal use of space in electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and efficiency in switching applications, making this product ideal for high-performance circuits.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating of 900A makes this FET suitable for applications requiring high power handling capabilities.

Avalanche Energy Rating (EAS): 493 mJ

The high avalanche energy rating indicates that the FET can withstand high energy spikes without damage, ensuring reliability in harsh operating conditions.

No. of Terminals: 5

Having 5 terminals allows for versatile connection options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high performance and efficiency, making this product a reliable choice for demanding applications.

Transistor Element Material: SILICON

Silicon-based transistors offer good thermal and electrical properties, ensuring stable performance over a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

The wide minimum operating temperature range of -55 °C ensures that the FET can function reliably in extreme cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides a reliable and corrosion-resistant connection for ensuring long-term performance of the FET.

Maximum Drain-Source On Resistance: 0.0022 ohm

Having a low drain-source on resistance of 0.0022 ohm minimizes power losses and improves efficiency in high-current applications.

Terminal Position: DUAL

Dual terminal positioning offers greater flexibility in circuit design and allows for easy integration into various applications.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and provides an efficient current path for the FET.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the FET can withstand high-temperature soldering processes without damage, ensuring robust manufacturing.

Reference Standard: AEC-Q101

Being compliant with the AEC-Q101 automotive standard ensures the reliability and quality of the FET for use in automotive electronics applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C430NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

493 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C430NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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