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NVMFS5C410NLT3G

Onsemi

NVMFS5C410NLT3G by Onsemi

NVMFS5C410NLT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0013 ohm RDS(on). It is used in automotive applications due to AEC-Q101 standard compliance and 175 °C operating temperature.

Median Price

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1k+

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Vyrian

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Microchip USA

USA . 4,104 parts In-Stock

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AZTECH Wire

Italy . 594 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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Corphita

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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Overview

Upgrade your power management with the NVMFS5C410NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs that provide reliable performance and efficiency. Ideal for a variety of applications, this N-Channel transistor offers enhanced mode operation and a built-in diode for added convenience. With a maximum drain current of 315A and an on-resistance of 0.0013 ohm, this transistor ensures optimal power dissipation and temperature control. Trust Onsemi to deliver cutting-edge technology for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent durability and protection for the internal components, ensuring a longer lifespan of the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the desired direction, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with a built-in diode makes the product more versatile and cost-effective for various applications.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation and protection against voltage spikes, enhancing the overall reliability of the product.

Surface Mount: YES

Enables easy and efficient integration into PCB designs, saving space and simplifying assembly processes.

Maximum Pulsed Drain Current (IDM): 900 A

Ability to handle high current pulses makes the product suitable for power applications with demanding requirements.

Avalanche Energy Rating (EAS): 706 mJ

High avalanche energy rating ensures robustness and reliability in high-stress environments, making the product suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 315 A

Capable of handling high continuous drain currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 167 W

High power dissipation capability allows for efficient heat management, ensuring stable operation under high power loads.

Maximum Operating Temperature: 175 °C

Wide operating temperature range enables the product to function reliably in various environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides efficient switching performance and low power consumption, making the product energy-efficient.

Maximum Drain-Source On Resistance: 0.0013 ohm

Low on-resistance minimizes power losses and improves efficiency in power transmission.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C410NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

706 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

315 A

Maximum Drain Current (ID):

315 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C410NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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