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NVMFS4C308NWFT1G

Onsemi

NVMFS4C308NWFT1G by Onsemi

NVMFS4C308NWFT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 144A IDM, and 0.007 ohm RDS(ON). It's used for SWITCHING applications in ENHANCEMENT MODE. This SMALL OUTLINE transistor operates b/w -55 to 175 °C with 39pF Crss.

Median Price

$5.290

Lifecycle Status

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4

In-Stock Inventory

1k+

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DigiKey

USA . 1,500 parts In-Stock

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$5.290

100+ parts

$2.515

1k+ parts

$2.415

10k+ parts

$1.973

1,500

$5.290

$2.515

$2.415

$1.973

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Flip Electronics

USA . 15,000 parts In-Stock

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Vyrian

USA . 8,948 parts In-Stock

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Digiode

USA . 1,760 parts In-Stock

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AZTECH Wire

Italy . 739 parts In-Stock

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$11.860

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Microchip USA

USA . 3,111 parts In-Stock

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Component Stockers USA

USA . 3,946 parts In-Stock

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$29.710

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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Problanco Electronics

Mexico . 8,021 parts In-Stock

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SupplyDigital Components

Austria . 3,530 parts In-Stock

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Kulean Microsystems

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Corphita

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TANS Electronics

Latvia . 1,080 parts In-Stock

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South Africa . 249 parts In-Stock

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Overview

Discover the NVMFS4C308NWFT1G by Onsemi, a high-quality Power Field Effect Transistor (FET) designed for switching applications. With its N-Channel configuration and built-in diode, this transistor offers reliable performance and efficiency. Perfect for a wide range of applications, this transistor boasts a maximum pulsed drain current of 144 A and a low on-resistance of 0.007 ohm, ensuring optimal power dissipation. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your electronics with the NVMFS4C308NWFT1G and experience unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower conduction resistance and faster switching speeds compared to P-channel FETs, making them ideal for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently turn on and off high power circuits.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle moderate voltage requirements in various applications.

Maximum Pulsed Drain Current (IDM): 144 A

The high pulsed drain current rating allows the FET to handle peak loads without overheating or failing.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS4C308NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

42 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

17.2 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

39 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

144 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVMFS4C308NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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