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NVHL082N65S3HF

Onsemi

NVHL082N65S3HF by Onsemi

NVHL082N65S3HF by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max IDM of 100A and 0.082 ohm Drain-Source Resistance. Operating in ENHANCEMENT MODE, this transistor has an EAS of 510mJ and can handle up to 313W power dissipation.

Median Price

$9.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 450 parts In-Stock

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$9.090

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$4.670

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450

$9.090

$4.670

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DigiKey

USA . 408 parts In-Stock

1+ parts

$9.130

100+ parts

$5.362

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$4.084

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408

$9.130

$5.362

$4.084

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Flip Electronics (Authorized)

USA . 5,850 parts In-Stock

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5,850

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Verical

USA . 5,850 parts In-Stock

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$4.110

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5,850

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$4.110

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Distributors (In-Stock)

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Digiode

USA . 371 parts In-Stock

1+ parts

$5.985

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371

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Flip Electronics

USA . 5,850 parts In-Stock

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5,850

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Vyrian

USA . 3,219 parts In-Stock

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Corphita

USA . 2,050 parts In-Stock

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$5.670

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$5.670

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Corohmni

South Africa . 160 parts In-Stock

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$6.300

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160

$6.300

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Microchip USA

USA . 2,661 parts In-Stock

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$15.031

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$15.031

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TANS Electronics

Latvia . 6,673 parts In-Stock

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SupplyDigital Components

Austria . 5,891 parts In-Stock

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Kulean Microsystems

USA . 5,439 parts In-Stock

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5,439

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Problanco Electronics

Mexico . 5,416 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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Overview

Unleash the power of innovation with the NVHL082N65S3HF by Onsemi, a top-tier manufacturer of Power Field Effect Transistors (FET). This N-channel transistor is designed for switching applications, offering a high breakdown voltage of 650V and a maximum drain current of 40A. Its single configuration with built-in diode ensures efficient performance, while its sturdy plastic/epoxy package body guarantees durability. Take your projects to the next level with the NVHL082N65S3HF and experience unmatched reliability, precision, and quality in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, making it suitable for various environments and applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for reverse current flow protection and simplifies circuit design.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Maximum Pulsed Drain Current (IDM): 100 A

High pulsed drain current allows for handling of large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 313 W

High power dissipation capability allows the transistor to handle high power loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low gate drive power requirements.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, making it suitable for applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NVHL082N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

510 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVHL082N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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