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NVHL065N65S3F

Onsemi

NVHL065N65S3F by Onsemi

NVHL065N65S3F by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 115A IDM. Ideal for applications requiring high power dissipation up to 337W, such as automotive systems due to AEC-Q101 standard compliance.

Median Price

$7.389

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 368 parts In-Stock

1+ parts

$9.440

100+ parts

$5.558

1k+ parts

$4.266

10k+ parts

-

368

$9.440

$5.558

$4.266

-

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

$27.600

100+ parts

$11.500

1k+ parts

-

10k+ parts

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250

$27.600

$11.500

-

-

Verical

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$5.338

1k+ parts

$4.775

10k+ parts

$4.487

440

-

$5.338

$4.775

$4.487

Rochester

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$4.270

1k+ parts

$3.820

10k+ parts

$3.590

440

-

$4.270

$3.820

$3.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,956 parts In-Stock

1+ parts

$7.790

100+ parts

-

1k+ parts

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1,956

$7.790

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Vyrian

USA . 3,824 parts In-Stock

1+ parts

-

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3,824

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Flip Electronics

USA . 900 parts In-Stock

1+ parts

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 122 parts In-Stock

1+ parts

$7.380

100+ parts

-

1k+ parts

-

10k+ parts

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122

$7.380

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-

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Component Stockers USA

USA . 521 parts In-Stock

1+ parts

$8.040

100+ parts

$5.740

1k+ parts

-

10k+ parts

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521

$8.040

$5.740

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-

Corohmni

South Africa . 410 parts In-Stock

1+ parts

$8.200

100+ parts

-

1k+ parts

-

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410

$8.200

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Microchip USA

USA . 359 parts In-Stock

1+ parts

$15.699

100+ parts

-

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359

$15.699

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SupplyDigital Components

Austria . 7,279 parts In-Stock

1+ parts

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7,279

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Kulean Microsystems

USA . 7,199 parts In-Stock

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7,199

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Problanco Electronics

Mexico . 2,855 parts In-Stock

1+ parts

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2,855

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TANS Electronics

Latvia . 2,585 parts In-Stock

1+ parts

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2,585

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 410 parts In-Stock

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410

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Overview

Experience superior power performance with the NVHL065N65S3F by Onsemi. As a leader in power field effect transistors, Onsemi delivers top-quality products that exceed industry standards. This N-channel transistor with built-in diode offers unparalleled reliability and efficiency, making it ideal for a wide range of applications. Whether you're looking to enhance the performance of your power electronics or seeking a reliable solution for your projects, the NVHL065N65S3F provides exceptional value and benefits that will meet your needs. Trust Onsemi for cutting-edge technology and superior quality in power transistors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in making the product lightweight and durable, making it easy to handle and resistant to external factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speed, making them suitable for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and protects the transistor from voltage spikes, improving overall reliability.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, ensuring reliable performance under varying conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and efficient use of space on a circuit board, maximizing the design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, making the installation process user-friendly and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the operation, enabling efficient power management and improved overall performance.

Maximum Pulsed Drain Current (IDM): 115 A

High pulsed drain current rating allows for handling short-duration peak loads, making this FET suitable for applications requiring high power output.

Avalanche Energy Rating (EAS): 635 mJ

High avalanche energy rating ensures the FET can withstand energy spikes without damage, enhancing its reliability in rugged operating conditions.

No. of Terminals: 3

Having three terminals allows for easy integration into a circuit, providing flexibility in connection options for various applications.

Maximum Power Dissipation (Abs): 337 W

High power dissipation capability ensures the FET can handle high power levels without overheating, improving overall reliability and performance.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure mounting and efficient heat dissipation, enhancing the overall reliability and longevity of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and fast switching speeds, making this FET ideal for power management applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating ensures the FET can withstand elevated temperatures, making it suitable for demanding industrial applications.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability, making this FET a durable and long-lasting choice for power applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the FET to operate in cold environments without performance degradation, ensuring reliable performance in varying conditions.

Maximum Drain Current (ID): 46 A

High maximum drain current rating allows for handling high current loads, making this FET suitable for power applications requiring high output levels.

Maximum Drain-Source On Resistance: 0.065 ohm

Low drain-source on resistance minimizes power loss and improves efficiency, making this FET an energy-efficient choice for power management applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and allows for easy integration into a circuit, improving overall usability and reliability.

Case Connection: DRAIN

Drain connection allows for efficient heat dissipation and reliable performance, ensuring the FET can handle high power levels without overheating.

Maximum Feedback Capacitance (Crss): 11 pF

Low feedback capacitance minimizes signal loss and distortion, improving signal integrity and overall performance of the FET in high-frequency applications.

Reference Standard: AEC-Q101

Conformance to AEC-Q101 standard ensures the FET meets stringent quality and reliability requirements, making it suitable for automotive and other demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NVHL065N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

635 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

46 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

115 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVHL065N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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