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NVHL027N65S3F

Onsemi

NVHL027N65S3F by Onsemi

NVHL027N65S3F by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 187.5A IDM and 1610mJ EAS, suitable for high-power operations. With a max power dissipation of 595W and operating temperature range from -55 to 150 °C, it offers reliable performance in various environments.

Median Price

$14.990

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3 parts In-Stock

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$8.390

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3

$8.390

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Farnell

UK . 24 parts In-Stock

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$14.990

100+ parts

$11.890

1k+ parts

$11.060

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24

$14.990

$11.890

$11.060

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DigiKey

USA . 405 parts In-Stock

1+ parts

$20.700

100+ parts

$13.046

1k+ parts

$11.806

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405

$20.700

$13.046

$11.806

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Mouser Electronics

USA . 223 parts In-Stock

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$20.700

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$20.700

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Newark

USA . 468 parts In-Stock

1+ parts

$25.840

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$17.310

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$16.960

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468

$25.840

$17.310

$16.960

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Element14

Singapore . 24 parts In-Stock

1+ parts

$26.800

100+ parts

$21.250

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$19.780

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24

$26.800

$21.250

$19.780

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Arrow

USA . 2,700 parts In-Stock

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$12.000

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2,700

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$12.000

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Verical

USA . 2,700 parts In-Stock

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$12.000

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2,700

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$12.000

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Rochester

USA . 1,378 parts In-Stock

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$11.810

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$10.570

10k+ parts

$9.940

1,378

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$11.810

$10.570

$9.940

Flip Electronics (Authorized)

USA . 188 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 268 parts In-Stock

1+ parts

$6.498

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$6.498

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Rapid Electronics

USA . 379 parts In-Stock

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379

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Vyrian

USA . 308 parts In-Stock

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308

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NAC Semi

USA . 240 parts In-Stock

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$19.810

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$18.330

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240

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$18.330

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Flip Electronics

USA . 188 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 149 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$0.684

100+ parts

$0.622

1k+ parts

$0.561

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70

$0.684

$0.622

$0.561

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Aztec Data Supply Inc.

USA . 1,224 parts In-Stock

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$1.779

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$1.779

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Corphita

USA . 1,810 parts In-Stock

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$6.156

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$6.156

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Corohmni

South Africa . 272 parts In-Stock

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$6.760

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Ampacity Inc.

Singapore . 308 parts In-Stock

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$7.130

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Continental Prestige Electronics

USA . 32 parts In-Stock

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$14.780

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$10.720

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Microchip USA

USA . 9,539 parts In-Stock

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$47.909

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Lixinc

USA . 7,896 parts In-Stock

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Kulean Microsystems

USA . 5,795 parts In-Stock

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Problanco Electronics

Mexico . 5,790 parts In-Stock

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TANS Electronics

Latvia . 2,692 parts In-Stock

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Argo Parts USA

USA . 2,266 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 997 parts In-Stock

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UHIMA Technologies

Türkiye . 353 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NVHL027N65S3F by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). This N-channel transistor with a built-in diode is perfect for switching applications, offering a high breakdown voltage of 650V and a maximum drain current of 75A. With a robust design and impressive power dissipation capabilities, this transistor ensures efficient operation even in demanding conditions. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments, making it a cost-effective choice.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower on-resistance, resulting in improved efficiency and power handling capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode allows for easy and efficient circuit design, reducing the need for external components and simplifying the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low on-resistance, ideal for power management and control applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage ensures reliable operation in high-voltage circuits, making it suitable for industrial and automotive applications.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, allowing for efficient PCB layout and integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ideal for applications where solder joint strength is critical.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and lower power consumption compared to depletion mode FETs, making them ideal for power switching applications.

Maximum Pulsed Drain Current (IDM): 187.5 A

The high pulsed drain current rating allows for reliable operation under high transient conditions, suitable for demanding applications.

Avalanche Energy Rating (EAS): 1610 mJ

The high avalanche energy rating ensures reliability and protection against voltage spikes, making it suitable for rugged and harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVHL027N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1610 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0274 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

187.5 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVHL027N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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