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NVHL020N120SC1

Onsemi

NVHL020N120SC1 by Onsemi

The Onsemi NVHL020N120SC1 is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max Pulsed Drain Current of 412A and Avalanche Energy Rating of 264mJ. With a Max Power Dissipation of 535W, this transistor operates in ENHANCEMENT MODE at temperatures ranging from -55 to 175°C.

Median Price

$40.100

Lifecycle Status

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13

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1k+

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Arrow

USA . 61 parts In-Stock

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$19.030

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$19.010

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Verical

USA . 61 parts In-Stock

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$19.030

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$19.010

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Mouser Electronics

USA . 937 parts In-Stock

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$39.690

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$39.690

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Rochester

USA . 280 parts In-Stock

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$40.510

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$38.080

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$34.440

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$40.510

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$34.440

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DigiKey

USA . 489 parts In-Stock

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$48.930

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$34.726

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Chip1Stop

Japan . 5 parts In-Stock

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$57.100

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Digiode

USA . 705 parts In-Stock

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$33.497

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$33.497

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Nova Conductors

Japan . 50 parts In-Stock

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$52.102

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Flip Electronics

USA . 1,350 parts In-Stock

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Chip Stock

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Vyrian

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IBS Electronics

USA . 250 parts In-Stock

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Tectiva GmbH

Germany . 12 parts In-Stock

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Corphita

USA . 1,188 parts In-Stock

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$31.734

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Corohmni

South Africa . 460 parts In-Stock

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$35.260

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Continental Prestige Electronics

USA . 2,244 parts In-Stock

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$52.102

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$51.060

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Netroflash

USA . 500 parts In-Stock

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$52.102

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$51.060

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Ampacity Inc.

Singapore . 232 parts In-Stock

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Microchip USA

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Lixinc

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Argo Parts USA

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TANS Electronics

Latvia . 3,614 parts In-Stock

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SupplyDigital Components

Austria . 3,243 parts In-Stock

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iodParts Technologies Inc.

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Perfect Parts

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Problanco Electronics

Mexico . 719 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 271 parts In-Stock

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Overview

Experience the unbeatable quality and performance of the NVHL020N120SC1 by Onsemi, a leading manufacturer in the industry. As a powerful Power Field Effect Transistor (FET) with N-CHANNEL polarity and SINGLE configuration, this transistor is perfect for SWITCHING applications. With a high DS Breakdown Voltage of 1200V and an impressive Maximum Drain Current of 103A, this transistor offers unmatched reliability and efficiency. Whether you're looking to enhance your electronic devices or improve power management systems, the NVHL020N120SC1 delivers exceptional value and benefits that will elevate your projects to new heights. Elevate your designs with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and heat resistance, ensuring the longevity of the product in various operating conditions.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET is suitable for high power applications where protection against voltage spikes is crucial.

Maximum Pulsed Drain Current (IDM): 412 A

The high pulsed drain current rating allows for the handling of large currents during short pulses, making it suitable for applications requiring high power output.

Maximum Power Dissipation (Abs): 535 W

The high power dissipation capability ensures that the FET can operate efficiently even under high load conditions without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to be used in environments with elevated temperatures without compromising performance.

Transistor Element Material: SILICON CARBIDE

The use of silicon carbide material offers high thermal conductivity and allows for efficient heat dissipation, ensuring reliable performance under high power conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVHL020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

103 A

Maximum Drain Current (ID):

103 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

412 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVHL020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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