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NVHL072N65S3

Onsemi

NVHL072N65S3 by Onsemi

NVHL072N65S3 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 110A and EAS of 214mJ, making it suitable for high-power operations. With an ID of 44A and 0.072 ohm RDS(on), this MOSFET operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C.

Median Price

$9.050

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 337 parts In-Stock

1+ parts

$9.050

100+ parts

$4.620

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-

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337

$9.050

$4.620

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DigiKey

USA . 182 parts In-Stock

1+ parts

$9.050

100+ parts

$5.310

1k+ parts

$4.036

10k+ parts

-

182

$9.050

$5.310

$4.036

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Element14

Singapore . 318 parts In-Stock

1+ parts

$9.390

100+ parts

$6.920

1k+ parts

$4.960

10k+ parts

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318

$9.390

$6.920

$4.960

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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Verical

USA . 334 parts In-Stock

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$5.050

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$4.513

10k+ parts

$4.250

334

-

$5.050

$4.513

$4.250

Rochester

USA . 334 parts In-Stock

1+ parts

-

100+ parts

$4.040

1k+ parts

$3.610

10k+ parts

$3.400

334

-

$4.040

$3.610

$3.400

Distributors (In-Stock)

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Digiode

USA . 1,645 parts In-Stock

1+ parts

$5.187

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1,645

$5.187

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Vyrian

USA . 7,734 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Corphita

USA . 2,207 parts In-Stock

1+ parts

$4.914

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-

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2,207

$4.914

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Continental Prestige Electronics

USA . 340 parts In-Stock

1+ parts

$5.010

100+ parts

$3.700

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340

$5.010

$3.700

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Corohmni

South Africa . 369 parts In-Stock

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$5.460

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369

$5.460

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Microchip USA

USA . 8,654 parts In-Stock

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$22.820

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$22.820

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QUARKTWIN TECHNOLOGY LTD

USA . 25,960 parts In-Stock

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25,960

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Problanco Electronics

Mexico . 8,282 parts In-Stock

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Kulean Microsystems

USA . 6,312 parts In-Stock

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SupplyDigital Components

Austria . 4,898 parts In-Stock

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TANS Electronics

Latvia . 3,853 parts In-Stock

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Perfect Parts

USA . 3,326 parts In-Stock

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3,326

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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170

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Experience the power of innovation with the NVHL072N65S3 by Onsemi. As a leading manufacturer in the industry, Onsemi offers top-quality Power Field Effect Transistors that are designed for switching applications. With a built-in diode and a high DS breakdown voltage of 650V, this N-CHANNEL transistor provides enhanced performance and reliability. Whether you're looking to optimize your power management system or improve efficiency in your designs, the NVHL072N65S3 delivers exceptional value and benefits. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Step into the future of power electronics with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, making them suitable for high-speed switching applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650 V allows for reliable operation in applications with high voltages.

Maximum Pulsed Drain Current (IDM): 110 A

The high pulsed drain current rating of 110 A indicates the FET can handle large current spikes during operation.

Maximum Power Dissipation (Abs): 312 W

With a maximum power dissipation of 312 W, this FET can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good reliability and performance for power switching applications.

Maximum Operating Temperature: 150 °C

The FET can operate at temperatures up to 150°C, making it suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

The FET can operate at low temperatures down to -55°C, providing versatility for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and ensures reliable electrical connections.

Technical Specifications

Power Field Effect Transistors (FET) NVHL072N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

214 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

44 A

Maximum Drain-Source On Resistance:

.072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVHL072N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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