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NVHL045N065SC1

Onsemi

NVHL045N065SC1 by Onsemi

NVHL045N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It features 304A Max Pulsed Drain Current and 325W Max Power Dissipation, ideal for high-power applications. With SILICON CARBIDE element material, it operates b/w -55 to 175 °C, making it suitable for industrial power systems.

Median Price

$15.621

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 398 parts In-Stock

1+ parts

$18.480

100+ parts

-

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$11.670

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398

$18.480

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$11.670

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DigiKey

USA . 372 parts In-Stock

1+ parts

$18.480

100+ parts

-

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$10.208

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372

$18.480

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$10.208

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Rochester

USA . 1,065 parts In-Stock

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-

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$10.210

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$9.140

10k+ parts

$8.600

1,065

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$10.210

$9.140

$8.600

Verical

USA . 1,065 parts In-Stock

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-

100+ parts

$12.762

1k+ parts

$11.425

10k+ parts

$10.750

1,065

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$12.762

$11.425

$10.750

Distributors (In-Stock)

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Digiode

USA . 2,033 parts In-Stock

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$16.454

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2,033

$16.454

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Vyrian

USA . 1,389 parts In-Stock

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$17.320

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Flip Electronics

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Corphita

USA . 1,829 parts In-Stock

1+ parts

$15.588

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1,829

$15.588

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$17.320

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292

$17.320

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SupplyDigital Components

Austria . 4,531 parts In-Stock

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4,531

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TANS Electronics

Latvia . 3,674 parts In-Stock

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Kulean Microsystems

USA . 2,578 parts In-Stock

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Problanco Electronics

Mexico . 949 parts In-Stock

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UHIMA Technologies

Türkiye . 80 parts In-Stock

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Overview

onsemi M2 EliteSiC MOSFETs feature voltage options of 650V, 750V, and 1200V. The onsemi M2 MOSFETs come in various packages, including D2PAK7, H-PSOF8L, TDFN4 8x8, TO-247-3LD, and TO-247-4LD. The MOSFETs provide flexibility in design and implementation. Additionally, the M2 EliteSiC MOSFETs boast a maximum gate-to-source voltage of +22V/-8V, low RDS(on), and high short circuit withstand time (SCWT).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and heat resistance, ensuring the FET can withstand harsh operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility, making them efficient for power applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the FET to handle high-power applications and prevents voltage spikes from damaging the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally-off, providing better control and efficiency in applications.

Maximum Drain Current (ID): 64.2 A

The high drain current rating allows the FET to handle large amounts of current without overheating, suitable for high-power applications.

Maximum Power Dissipation (Abs): 325 W

The high power dissipation rating indicates the FET can handle high power levels while maintaining reliability and stability.

Technical Specifications

Power Field Effect Transistors (FET) NVHL045N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

64.2 A

Maximum Drain Current (ID):

64.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14.53 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

304 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVHL045N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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