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NVHL060N065SC1

Onsemi

NVHL060N065SC1 by Onsemi

NVHL060N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It features 225A Max Pulsed Drain Current and 257W Max Power Dissipation, suitable for high-power applications like industrial motor drives and power supplies.

Median Price

$15.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 450 parts In-Stock

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$15.570

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-

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$8.188

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450

$15.570

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$8.188

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Mouser Electronics

USA . 445 parts In-Stock

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$15.570

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$9.360

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445

$15.570

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$9.360

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Distributors (In-Stock)

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Digiode

USA . 838 parts In-Stock

1+ parts

$13.870

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838

$13.870

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Vyrian

USA . 2,428 parts In-Stock

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Flip Electronics

USA . 1,350 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 424 parts In-Stock

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$13.140

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424

$13.140

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Corohmni

South Africa . 406 parts In-Stock

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$14.600

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406

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Problanco Electronics

Mexico . 6,959 parts In-Stock

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6,959

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Kulean Microsystems

USA . 5,886 parts In-Stock

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TANS Electronics

Latvia . 1,416 parts In-Stock

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SupplyDigital Components

Austria . 817 parts In-Stock

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UHIMA Technologies

Türkiye . 82 parts In-Stock

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Overview

onsemi M2 EliteSiC MOSFETs feature voltage options of 650V, 750V, and 1200V. The onsemi M2 MOSFETs come in various packages, including D2PAK7, H-PSOF8L, TDFN4 8x8, TO-247-3LD, and TO-247-4LD. The MOSFETs provide flexibility in design and implementation. Additionally, the M2 EliteSiC MOSFETs boast a maximum gate-to-source voltage of +22V/-8V, low RDS(on), and high short circuit withstand time (SCWT).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the FET, making it durable and reliable.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows for the FET to handle high voltage applications without damage, increasing its versatility.

Maximum Pulsed Drain Current (IDM): 225 A

High pulsed drain current capability makes this FET suitable for applications that require high power bursts.

Maximum Power Dissipation (Abs): 257 W

High power dissipation capability ensures that the FET can handle high power loads without overheating, increasing its reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology provides high performance and efficiency, making this FET a good choice for demanding applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the FET to operate in a wide range of environments, increasing its versatility.

Transistor Element Material: SILICON CARBIDE

Silicon Carbide material offers high temperature tolerance and efficiency, making this FET suitable for tough operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVHL060N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

49.08 A

Maximum Drain Current (ID):

49.08 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10.95 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

225 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVHL060N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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