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NVHL025N65S3

Onsemi

NVHL025N65S3 by Onsemi

NVHL025N65S3 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a max IDM of 187.5A and EAS of 2025mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers 0.025 ohm RDS(on) and can handle up to 595W power dissipation at temperatures ranging from -55 to 150 °C.

Median Price

$21.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 213 parts In-Stock

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$21.420

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$14.100

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213

$21.420

$14.100

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DigiKey

USA . 120 parts In-Stock

1+ parts

$21.420

100+ parts

$13.538

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$12.329

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120

$21.420

$13.538

$12.329

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Distributors (In-Stock)

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Digiode

USA . 1,262 parts In-Stock

1+ parts

$29.374

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1,262

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Vyrian

USA . 2,085 parts In-Stock

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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Distributors (Availability)

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Corohmni

South Africa . 357 parts In-Stock

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$11.742

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357

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Corphita

USA . 602 parts In-Stock

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$27.828

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602

$27.828

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Component Stockers USA

USA . 453 parts In-Stock

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$30.340

100+ parts

$25.240

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453

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$25.240

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Microchip USA

USA . 6,603 parts In-Stock

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$74.635

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TANS Electronics

Latvia . 8,391 parts In-Stock

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SupplyDigital Components

Austria . 8,207 parts In-Stock

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Problanco Electronics

Mexico . 7,708 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 1,667 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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Perfect Parts

USA . 465 parts In-Stock

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465

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance your power systems with the NVHL025N65S3 by Onsemi, a high-quality N-channel power field effect transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET is versatile and ideal for switching applications. With a maximum drain-source on resistance of 0.025 ohm and a maximum operating temperature of 150 °C, this transistor delivers superior efficiency and durability. Experience the benefits of enhanced power control and optimal performance with the NVHL025N65S3, setting a new standard in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance in terms of conductivity and efficiency compared to P-channel FETs, making this transistor a suitable choice for various applications.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage, this transistor can handle high voltage applications without the risk of damage or failure.

Maximum Power Dissipation (Abs): 595 W

The high power dissipation rating allows this transistor to handle heavy loads and high power applications effectively without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and improved efficiency, making this transistor a reliable and efficient choice for switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures the transistor can operate in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVHL025N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2025 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

187.5 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVHL025N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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