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NVHL040N65S3HF

Onsemi

NVHL040N65S3HF by Onsemi

NVHL040N65S3HF by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 162.5A IDM. Ideal for SWITCHING applications, it features 0.04 ohm RDS(on) and 446W Pdiss in a RECTANGULAR package with Matte Tin finish.

Median Price

$13.710

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 450 parts In-Stock

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$13.710

100+ parts

$7.940

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450

$13.710

$7.940

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DigiKey

USA . 426 parts In-Stock

1+ parts

$13.710

100+ parts

$8.334

1k+ parts

$6.947

10k+ parts

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426

$13.710

$8.334

$6.947

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Distributors (In-Stock)

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Digiode

USA . 512 parts In-Stock

1+ parts

$12.398

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512

$12.398

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Vyrian

USA . 2,482 parts In-Stock

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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Distributors (Availability)

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Corphita

USA . 142 parts In-Stock

1+ parts

$11.745

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142

$11.745

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Corohmni

South Africa . 70 parts In-Stock

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$13.050

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70

$13.050

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Microchip USA

USA . 3,275 parts In-Stock

1+ parts

$23.918

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3,275

$23.918

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Problanco Electronics

Mexico . 8,369 parts In-Stock

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8,369

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TANS Electronics

Latvia . 4,723 parts In-Stock

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SupplyDigital Components

Austria . 4,488 parts In-Stock

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4,488

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Kulean Microsystems

USA . 2,656 parts In-Stock

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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145

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Overview

Unleash the power of innovation with the NVHL040N65S3HF by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This N-CHANNEL Power Field Effect Transistor is ideal for switching applications, offering a breakthrough in performance and efficiency. With a high DS Breakdown Voltage of 650 V and a Maximum Drain Current of 65 A, this transistor ensures seamless operation even in the most demanding environments. Transform your projects with the unmatched value and benefits of the NVHL040N65S3HF - the ultimate choice for cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the FET lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of damage.

Maximum Pulsed Drain Current (IDM): 162.5 A

The high pulsed drain current rating allows this FET to handle spikes in current without overheating or failure.

Maximum Power Dissipation (Abs): 446 W

The high power dissipation rating ensures that this FET can handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand high temperatures without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NVHL040N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVHL040N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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