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NTTFS4937NTWG

Onsemi

NTTFS4937NTWG by Onsemi

NTTFS4937NTWG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 75A Drain Current, and 0.007 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. This SQUARE package features a BUILT-IN DIODE and NO LEAD terminals for surface mount assembly.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 51,000 parts In-Stock

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Vyrian

USA . 11,258 parts In-Stock

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USA . 10,500 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 654 parts In-Stock

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$21.660

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Component Stockers USA

USA . 672 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Perfect Parts

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SupplyDigital Components

Austria . 3,985 parts In-Stock

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Problanco Electronics

Mexico . 2,120 parts In-Stock

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TANS Electronics

Latvia . 1,862 parts In-Stock

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Overview

Unleash the power of innovation with the NTTFS4937NTWG by Onsemi. As a leading manufacturer in the industry of Small Signal Field Effect Transistors, Onsemi delivers unmatched quality and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing enhanced performance and efficiency. Say goodbye to limitations with a maximum drain current of 75A and a minimum DS breakdown voltage of 30V. Elevate your projects with the NTTFS4937NTWG and experience seamless functionality like never before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this product suitable for applications requiring quick response times.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, enhancing the reliability of the product in various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and low power dissipation, making it ideal for use in circuits that require frequent on/off operations.

Surface Mount: YES

Surface mount technology provides a compact and convenient solution for circuit board design, allowing for space-saving and automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can withstand high voltages without experiencing a breakdown, ensuring the safety and reliability of the circuit.

Package Shape: SQUARE

The square package shape offers a stable and secure mounting option for the FET, making it easier to integrate into different electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to control the flow of current, providing better control and efficiency in switching applications.

Maximum Drain Current (Abs) (ID): 75 A

With a high maximum drain current of 75A, this FET can handle large currents and power levels, making it suitable for high-power switching applications.

No. of Terminals: 5

The 5 terminals provide multiple connection points for input/output signals, enabling versatile circuit configurations and allowing for efficient control of the FET.

Maximum Power Dissipation (Abs): 43.1 W

The high power dissipation capability of 43.1W ensures that the FET can operate reliably under heavy load conditions, maintaining performance and stability.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact and lightweight design, making it suitable for space-constrained applications and improving overall system efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high speed and low power consumption, making this FET an energy-efficient and reliable choice for various electronic applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures without experiencing performance degradation, ensuring reliable operation in demanding environments.

Transistor Element Material: SILICON

Silicon-based transistor elements offer excellent thermal stability and high performance, making this FET a durable and reliable choice for long-term use.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good electrical conductivity and corrosion resistance, ensuring reliable connection and preventing oxidation for improved signal transmission.

Maximum Drain-Source On Resistance: 0.007 ohm

The low on-resistance of 0.007 ohm minimizes power loss and heat dissipation, resulting in improved efficiency and performance in high-current switching applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and allows for easy connection to other components, enhancing the versatility and usability of the FET.

Case Connection: DRAIN

The drain case connection provides a convenient grounding point for the FET, enhancing overall circuit stability and minimizing interference for improved performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4937NTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4937NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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