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NTTFS4929NTAG

Onsemi

NTTFS4929NTAG by Onsemi

NTTFS4929NTAG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 69A Max Pulsed Drain Current, and 0.017 ohm Max RDS(on). With a small outline package style and operating temperature up to 150 °C, it is ideal for high-power switching circuits.

Median Price

$0.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 134,039 parts In-Stock

1+ parts

-

100+ parts

$0.321

1k+ parts

$0.266

10k+ parts

$0.237

134,039

-

$0.321

$0.266

$0.237

Verical

USA . 134,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.378

10k+ parts

$0.311

134,039

-

-

$0.378

$0.311

Flip Electronics (Authorized)

USA . 4,500 parts In-Stock

1+ parts

-

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4,500

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Distributors (In-Stock)

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Digiode

USA . 78 parts In-Stock

1+ parts

$0.262

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-

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78

$0.262

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Vyrian

USA . 5,504 parts In-Stock

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5,504

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Flip Electronics

USA . 4,500 parts In-Stock

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4,500

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Distributors (Availability)

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Corphita

USA . 619 parts In-Stock

1+ parts

$0.248

100+ parts

-

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619

$0.248

-

-

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Corohmni

South Africa . 233 parts In-Stock

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$0.276

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233

$0.276

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AZTECH Wire

Italy . 103 parts In-Stock

1+ parts

$15.910

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103

$15.910

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Metaverse IC Inc.

Canada . 139,090 parts In-Stock

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139,090

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Continental Prestige Electronics

USA . 135,000 parts In-Stock

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$0.253

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$0.253

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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15,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,262 parts In-Stock

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8,262

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TANS Electronics

Latvia . 8,164 parts In-Stock

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SupplyDigital Components

Austria . 7,825 parts In-Stock

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7,825

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QUARKTWIN TECHNOLOGY LTD

USA . 7,042 parts In-Stock

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7,042

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S.R.D Solutions

India . 7,000 parts In-Stock

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7,000

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Problanco Electronics

Mexico . 3,419 parts In-Stock

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UHIMA Technologies

Türkiye . 562 parts In-Stock

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562

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Overview

Unlock the power of innovation with the NTTFS4929NTAG by Onsemi. Designed to deliver top-quality performance, this Power Field Effect Transistor (FET) features a single configuration with a built-in diode, making it ideal for switching applications. With a maximum pulsing drain current of 69A and a minimum DS breakdown voltage of 30V, this transistor offers reliable operation in various scenarios. Trust in Onsemi's expertise and elevate your projects with the unmatched value and benefits that the NTTFS4929NTAG brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better conductivity and efficiency compared to P-channel FETs, making them suitable for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power management and control.

Maximum Pulsed Drain Current (IDM): 69 A

High maximum pulsed drain current allows for handling of high transient loads without damage.

Maximum Power Dissipation (Abs): 22.3 W

High power dissipation capability ensures the FET can operate effectively under high load conditions without overheating.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without sacrificing performance.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS4929NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

34 A

Maximum Drain Current (ID):

10.6 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

69 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4929NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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