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NTPF600N80S3Z

Onsemi

NTPF600N80S3Z by Onsemi

NTPF600N80S3Z by Onsemi is a Power FET with 800V DS Breakdown Voltage, 21A IDM, and 0.6 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 28W. With a temperature range from -55 to 150 °C, this N-CHANNEL FET is designed for high-power requirements.

Median Price

$1.364

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 972 parts In-Stock

1+ parts

$3.850

100+ parts

$1.960

1k+ parts

$1.430

10k+ parts

-

972

$3.850

$1.960

$1.430

-

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

9,000

-

$1.240

$1.110

$1.050

Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.313

8,000

-

-

$1.387

$1.313

DigiKey

USA . 3,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.340

10k+ parts

-

3,259

-

-

$1.340

-

Flip Electronics (Authorized)

USA . 3,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,259

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,531 parts In-Stock

1+ parts

$1.311

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$1.311

-

-

-

Vyrian

USA . 1,158 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

$1.380

-

-

-

IBS Electronics

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

$3.001

1k+ parts

$2.889

10k+ parts

$2.861

60,000

-

$3.001

$2.889

$2.861

NAC Semi

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

$4.280

1k+ parts

-

10k+ parts

-

48,000

-

$4.280

-

-

Flip Electronics

USA . 10,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,259

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 876 parts In-Stock

1+ parts

$1.242

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$1.242

-

-

-

Corohmni

South Africa . 86 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

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86

$1.380

-

-

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Microchip USA

USA . 2,871 parts In-Stock

1+ parts

$9.952

100+ parts

-

1k+ parts

-

10k+ parts

-

2,871

$9.952

-

-

-

Component Stockers USA

USA . 4,978 parts In-Stock

1+ parts

$18.500

100+ parts

-

1k+ parts

-

10k+ parts

-

4,978

$18.500

-

-

-

Problanco Electronics

Mexico . 7,721 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,721

-

-

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SupplyDigital Components

Austria . 6,305 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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6,305

-

-

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Kulean Microsystems

USA . 5,170 parts In-Stock

1+ parts

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100+ parts

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5,170

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QUARKTWIN TECHNOLOGY LTD

USA . 4,302 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,302

-

-

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TANS Electronics

Latvia . 3,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,210

-

-

-

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UHIMA Technologies

Türkiye . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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247

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Overview

Discover the NTPF600N80S3Z by Onsemi, a high-quality Power FET that offers outstanding performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-Channel transistor is ideal for switching applications. With a robust design and built-in diode, this transistor ensures efficient power management and enhanced functionality. Whether you're looking to optimize your power systems or improve device performance, the NTPF600N80S3Z delivers exceptional value and benefits. Trust Onsemi for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode for ease of use and increased efficiency.

Transistor Application: SWITCHING

Designed for efficient switching applications, making it suitable for a wide range of uses.

Minimum DS Breakdown Voltage: 800 V

Can handle high voltage applications and ensures reliability in demanding conditions.

Maximum Pulsed Drain Current (IDM): 21 A

Capable of handling high current spikes and peak loads for reliable performance.

Maximum Power Dissipation (Abs): 28 W

Efficient power handling capability for sustained operation without overheating.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.6 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) NTPF600N80S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

24 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

21 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF600N80S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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