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NTPF360N80S3Z

Onsemi

NTPF360N80S3Z by Onsemi

NTPF360N80S3Z by Onsemi is a single N-channel power FET with 800V DS breakdown voltage, 32.5A IDM, and 0.36 ohm RDS(on). Ideal for switching applications in various industries due to its high power dissipation of 31W and operating temperature range from -55 to 150°C.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 468 parts In-Stock

1+ parts

$0.825

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-

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468

$0.825

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Mouser Electronics

USA . 736 parts In-Stock

1+ parts

$4.400

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736

$4.400

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DigiKey

USA . 1,958 parts In-Stock

1+ parts

$4.520

100+ parts

$2.112

1k+ parts

$1.621

10k+ parts

$1.595

1,958

$4.520

$2.112

$1.621

$1.595

Chip1Stop

Japan . 579 parts In-Stock

1+ parts

$10.200

100+ parts

$4.390

1k+ parts

$3.210

10k+ parts

-

579

$10.200

$4.390

$3.210

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Verical

USA . 2,000 parts In-Stock

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$1.605

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2,000

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$1.605

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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2,000

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Rochester

USA . 1,549 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.440

10k+ parts

$1.350

1,549

-

$1.610

$1.440

$1.350

RS (Exports)

UK . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.710

10k+ parts

$1.847

950

-

-

$1.710

$1.847

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 704 parts In-Stock

1+ parts

$0.802

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704

$0.802

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Vyrian

USA . 1,268 parts In-Stock

1+ parts

$0.844

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1,268

$0.844

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Flip Electronics

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

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Corphita

USA . 870 parts In-Stock

1+ parts

$0.760

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870

$0.760

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Corohmni

South Africa . 210 parts In-Stock

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$0.844

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210

$0.844

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Microchip USA

USA . 7,056 parts In-Stock

1+ parts

$23.335

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7,056

$23.335

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SupplyDigital Components

Austria . 4,036 parts In-Stock

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4,036

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QUARKTWIN TECHNOLOGY LTD

USA . 3,632 parts In-Stock

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3,632

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Kulean Microsystems

USA . 3,466 parts In-Stock

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Perfect Parts

USA . 3,301 parts In-Stock

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TANS Electronics

Latvia . 2,919 parts In-Stock

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2,919

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Problanco Electronics

Mexico . 2,256 parts In-Stock

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2,256

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GreenTree Electronics

Israel . 679 parts In-Stock

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679

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UHIMA Technologies

Türkiye . 275 parts In-Stock

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275

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Overview

Unlock the power of high-quality performance with the NTPF360N80S3Z by Onsemi. Designed for efficiency and reliability, this Power Field Effect Transistor offers customers a seamless switching experience in a variety of applications. With its N-CHANNEL configuration and built-in diode, this product provides enhanced functionality and versatility. Trust in Onsemi's reputation for excellence in semiconductor technology and elevate your projects with the value and benefits that the NTPF360N80S3Z brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient and reliable performance in switching applications.

Minimum DS Breakdown Voltage: 800 V

Capable of handling high voltages, making it suitable for a variety of power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces component count by including a diode within the transistor package.

Maximum Pulsed Drain Current (IDM): 32.5 A

Allows for high current handling capability, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Operates reliably in high temperature environments, ensuring stability under varying conditions.

Maximum Power Dissipation (Abs): 31 W

Can handle high power dissipation, enabling it to work efficiently in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTPF360N80S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32.5 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF360N80S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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