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NTPF250N65S3H

Onsemi

NTPF250N65S3H by Onsemi

NTPF250N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 36A IDM, and 0.25 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 29W. This N-CHANNEL transistor has a RECTANGULAR package shape and can withstand temperatures from -55 to 150 °C.

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 35 parts In-Stock

1+ parts

$3.420

100+ parts

$1.740

1k+ parts

$1.450

10k+ parts

-

35

$3.420

$1.740

$1.450

-

Newark

USA . 35 parts In-Stock

1+ parts

$4.240

100+ parts

$2.020

1k+ parts

$1.830

10k+ parts

-

35

$4.240

$2.020

$1.830

-

Mouser Electronics

USA . 991 parts In-Stock

1+ parts

$4.520

100+ parts

$2.090

1k+ parts

$2.010

10k+ parts

-

991

$4.520

$2.090

$2.010

-

DigiKey

USA . 486 parts In-Stock

1+ parts

$4.850

100+ parts

$2.284

1k+ parts

$1.762

10k+ parts

$1.756

486

$4.850

$2.284

$1.762

$1.756

Element14

Singapore . 35 parts In-Stock

1+ parts

$5.960

100+ parts

$3.040

1k+ parts

$2.540

10k+ parts

-

35

$5.960

$3.040

$2.540

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Rochester

USA . 1,937 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

1,937

-

$1.750

$1.560

$1.470

Verical

USA . 1,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

1,372

-

-

$1.950

$1.837

Avnet

USA . 100 parts In-Stock

1+ parts

-

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-

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100

-

-

-

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Distributors (In-Stock)

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Digiode

USA . 1,525 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

-

10k+ parts

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1,525

$1.852

-

-

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Vyrian

USA . 356 parts In-Stock

1+ parts

$1.950

100+ parts

-

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-

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356

$1.950

-

-

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Flip Electronics

USA . 17,000 parts In-Stock

1+ parts

-

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17,000

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NAC Semi

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$4.600

1k+ parts

$4.140

10k+ parts

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400

-

$4.600

$4.140

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,678 parts In-Stock

1+ parts

$1.755

100+ parts

-

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-

10k+ parts

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1,678

$1.755

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-

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Corohmni

South Africa . 176 parts In-Stock

1+ parts

$1.950

100+ parts

-

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-

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176

$1.950

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-

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Continental Prestige Electronics

USA . 87 parts In-Stock

1+ parts

$2.600

100+ parts

$1.930

1k+ parts

$1.850

10k+ parts

-

87

$2.600

$1.930

$1.850

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Microchip USA

USA . 3,691 parts In-Stock

1+ parts

$25.610

100+ parts

-

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3,691

$25.610

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Problanco Electronics

Mexico . 4,036 parts In-Stock

1+ parts

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4,036

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-

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TANS Electronics

Latvia . 3,981 parts In-Stock

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3,981

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Kulean Microsystems

USA . 3,772 parts In-Stock

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3,772

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Perfect Parts

USA . 3,651 parts In-Stock

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3,651

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SupplyDigital Components

Austria . 1,949 parts In-Stock

1+ parts

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1,949

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GreenTree Electronics

Israel . 840 parts In-Stock

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840

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Authorized Procurement Solutions

USA . 740 parts In-Stock

1+ parts

-

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740

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UHIMA Technologies

Türkiye . 39 parts In-Stock

1+ parts

-

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39

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Overview

Unlock the power of innovation with the NTPF250N65S3H by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) is designed to elevate your switching applications to new heights. With a robust construction and built-in diode, this N-channel transistor offers unrivaled performance and reliability. Experience seamless operation and enhanced efficiency with a maximum pulsed drain current of 36A and a minimum DS breakdown voltage of 650V. Embrace the future of technology with Onsemi's cutting-edge transistor technology, providing you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the FET component, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and higher electron mobility, making them ideal for high-performance switching applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V indicates that this FET can handle high voltage applications without breakdown, ensuring reliability and longevity.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current rating of 36A allows this FET to handle high current spikes, making it suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 29 W

With a maximum power dissipation of 29W, this FET can efficiently handle power without overheating, ensuring stable operation in demanding conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this FET to operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTPF250N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

108 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF250N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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