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NTPF165N65S3H

Onsemi

NTPF165N65S3H by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 33 W; Operating Mode: ENHANCEMENT MODE; JESD-30 Code: R-PSFM-T3;

Median Price

$5.040

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,005 parts In-Stock

1+ parts

$3.890

100+ parts

$2.150

1k+ parts

$1.780

10k+ parts

-

1,005

$3.890

$2.150

$1.780

-

Mouser Electronics

USA . 11,933 parts In-Stock

1+ parts

$5.040

100+ parts

$2.490

1k+ parts

$2.390

10k+ parts

-

11,933

$5.040

$2.490

$2.390

-

Newark

USA . 1,001 parts In-Stock

1+ parts

$5.200

100+ parts

$2.620

1k+ parts

$2.460

10k+ parts

-

1,001

$5.200

$2.620

$2.460

-

DigiKey

USA . 995 parts In-Stock

1+ parts

$5.500

100+ parts

$2.631

1k+ parts

$2.083

10k+ parts

-

995

$5.500

$2.631

$2.083

-

Element14

Singapore . 1,005 parts In-Stock

1+ parts

$6.550

100+ parts

$3.620

1k+ parts

$3.000

10k+ parts

-

1,005

$6.550

$3.620

$3.000

-

Rochester

USA . 437 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

437

-

$2.090

$1.870

$1.760

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.337

10k+ parts

$2.200

250

-

-

$2.337

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,196 parts In-Stock

1+ parts

$2.194

100+ parts

-

1k+ parts

-

10k+ parts

-

2,196

$2.194

-

-

-

Vyrian

USA . 602 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

602

$2.310

-

-

-

Flip Electronics

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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50,000

-

-

-

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.280

10k+ parts

$3.030

2,000

-

-

$3.280

$3.030

Ashlea Components Ltd

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 819 parts In-Stock

1+ parts

$2.079

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$2.079

-

-

-

Corohmni

South Africa . 227 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$2.310

-

-

-

Continental Prestige Electronics

USA . 452 parts In-Stock

1+ parts

$4.380

100+ parts

$2.800

1k+ parts

$2.430

10k+ parts

-

452

$4.380

$2.800

$2.430

-

Microchip USA

USA . 2,282 parts In-Stock

1+ parts

$30.420

100+ parts

-

1k+ parts

-

10k+ parts

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2,282

$30.420

-

-

-

Kulean Microsystems

USA . 8,392 parts In-Stock

1+ parts

-

100+ parts

-

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8,392

-

-

-

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Problanco Electronics

Mexico . 6,158 parts In-Stock

1+ parts

-

100+ parts

-

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6,158

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

SupplyDigital Components

Austria . 2,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,658

-

-

-

-

TANS Electronics

Latvia . 1,233 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,233

-

-

-

-

UHIMA Technologies

Türkiye . 349 parts In-Stock

1+ parts

-

100+ parts

-

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349

-

-

-

-

Technical Specifications

Power Field Effect Transistors (FET) NTPF165N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

163 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

53 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF165N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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