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NTPF110N65S3HF

Onsemi

NTPF110N65S3HF by Onsemi

NTPF110N65S3HF by Onsemi is a Power FET with 650V DS Breakdown Voltage, ideal for switching applications. It features a max IDM of 69A and EAS of 380mJ, operating in enhancement mode. With a package style of Flange Mount and an RDS(on) of 0.11 ohm, it offers efficient performance in various power electronics designs.

Median Price

$5.941

Lifecycle Status

Suppliers In-Stock

14

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1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 643 parts In-Stock

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$1.196

100+ parts

$1.191

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$1.187

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643

$1.196

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$1.187

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Chip1Stop

Japan . 828 parts In-Stock

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$4.360

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828

$4.360

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Element14

Singapore . 466 parts In-Stock

1+ parts

$5.941

100+ parts

$4.216

1k+ parts

$3.221

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466

$5.941

$4.216

$3.221

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Farnell

UK . 466 parts In-Stock

1+ parts

$6.345

100+ parts

$4.073

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$3.121

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466

$6.345

$4.073

$3.121

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Mouser Electronics

USA . 25 parts In-Stock

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$6.820

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$3.350

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25

$6.820

$3.350

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DigiKey

USA . 311 parts In-Stock

1+ parts

$7.100

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$3.495

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$2.928

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311

$7.100

$3.495

$2.928

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Newark

USA . 322 parts In-Stock

1+ parts

$7.810

100+ parts

$4.710

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$4.570

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322

$7.810

$4.710

$4.570

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Verical

USA . 6,000 parts In-Stock

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$2.946

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$2.946

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RS (Exports)

UK . 1 parts In-Stock

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-

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$3.813

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$3.401

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1

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$3.813

$3.401

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Distributors (In-Stock)

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Digiode

USA . 2,148 parts In-Stock

1+ parts

$2.824

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$2.824

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Nova Conductors

Japan . 25 parts In-Stock

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$3.385

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25

$3.385

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Vyrian

USA . 11,040 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Rapid Electronics

USA . 687 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 121 parts In-Stock

1+ parts

$1.930

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121

$1.930

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Ampacity Inc.

Singapore . 329 parts In-Stock

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$2.530

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$2.530

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Corphita

USA . 960 parts In-Stock

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$2.676

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$2.676

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Corohmni

South Africa . 175 parts In-Stock

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$2.973

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$2.973

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Aranea Global

USA . 100 parts In-Stock

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$3.317

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$3.185

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100

$3.317

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$3.185

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Argo Parts USA

USA . 2,368 parts In-Stock

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$3.385

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Continental Prestige Electronics

USA . 541 parts In-Stock

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$4.300

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$3.230

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$2.300

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541

$4.300

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$2.300

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Microchip USA

USA . 6,298 parts In-Stock

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$18.424

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Lixinc

USA . 18,793 parts In-Stock

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Perfect Parts

USA . 11,627 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 8,112 parts In-Stock

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SupplyDigital Components

Austria . 6,367 parts In-Stock

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Problanco Electronics

Mexico . 1,213 parts In-Stock

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Kulean Microsystems

USA . 942 parts In-Stock

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UHIMA Technologies

Türkiye . 278 parts In-Stock

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Overview

Unleash the power of innovation with the NTPF110N65S3HF by Onsemi, a high-quality Power Field Effect Transistor designed to revolutionize your switching applications. Manufactured by industry leader Onsemi, this N-CHANNEL transistor offers unrivaled performance and reliability, with a built-in diode for added convenience. Ideal for a wide range of electronic devices, this transistor provides enhanced efficiency and durability, ensuring seamless operation even in the most demanding conditions. Upgrade your systems today with the NTPF110N65S3HF and experience the difference in quality and performance that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the transistor suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient operation in certain circuit configurations, ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for rapid switching applications, ensuring high performance and reliability.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance minimizes power loss and heat dissipation, increasing efficiency in operation.

Technical Specifications

Power Field Effect Transistors (FET) NTPF110N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

380 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

69 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF110N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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