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NTPF360N65S3H

Onsemi

NTPF360N65S3H by Onsemi

NTPF360N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 28A IDM, and 0.36 ohm RDS(on). Ideal for switching applications in power electronics due to its N-CHANNEL configuration and 26W Pd. Operating in enhancement mode, it offers high performance with an EAS of 75mJ.

Median Price

$2.960

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 959 parts In-Stock

1+ parts

$0.940

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-

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959

$0.940

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Farnell

UK . 897 parts In-Stock

1+ parts

$2.440

100+ parts

$1.200

1k+ parts

$1.100

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897

$2.440

$1.200

$1.100

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Element14

Singapore . 897 parts In-Stock

1+ parts

$2.710

100+ parts

$2.170

1k+ parts

$2.100

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897

$2.710

$2.170

$2.100

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Mouser Electronics

USA . 766 parts In-Stock

1+ parts

$3.210

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766

$3.210

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Newark

USA . 895 parts In-Stock

1+ parts

$3.630

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$1.780

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895

$3.630

$1.780

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DigiKey

USA . 910 parts In-Stock

1+ parts

$4.210

100+ parts

$1.962

1k+ parts

$1.514

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910

$4.210

$1.962

$1.514

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Chip1Stop

Japan . 725 parts In-Stock

1+ parts

$10.800

100+ parts

$4.630

1k+ parts

$3.400

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725

$10.800

$4.630

$3.400

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Rochester

USA . 2,632 parts In-Stock

1+ parts

-

100+ parts

$1.510

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$1.350

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$1.270

2,632

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$1.510

$1.350

$1.270

Verical

USA . 2,632 parts In-Stock

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$1.688

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2,632

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$1.688

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Flip Electronics (Authorized)

USA . 1,569 parts In-Stock

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1,569

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RS (Exports)

UK . 946 parts In-Stock

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100+ parts

$3.965

1k+ parts

$3.573

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946

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$3.965

$3.573

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Distributors (In-Stock)

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Digiode

USA . 256 parts In-Stock

1+ parts

$0.893

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256

$0.893

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Vyrian

USA . 1,210 parts In-Stock

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$0.940

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1,210

$0.940

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Flip Electronics

USA . 2,569 parts In-Stock

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2,569

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Cyclops Electronics Ltd

UK . 202 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,179 parts In-Stock

1+ parts

$0.846

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2,179

$0.846

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Corohmni

South Africa . 73 parts In-Stock

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$0.940

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73

$0.940

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Component Stockers USA

USA . 10,447 parts In-Stock

1+ parts

$0.990

100+ parts

$0.960

1k+ parts

$1.560

10k+ parts

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10,447

$0.990

$0.960

$1.560

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Continental Prestige Electronics

USA . 925 parts In-Stock

1+ parts

$3.760

100+ parts

$2.580

1k+ parts

$1.260

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925

$3.760

$2.580

$1.260

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Microchip USA

USA . 8,972 parts In-Stock

1+ parts

$15.820

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8,972

$15.820

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QUARKTWIN TECHNOLOGY LTD

USA . 28,809 parts In-Stock

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Problanco Electronics

Mexico . 8,324 parts In-Stock

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TANS Electronics

Latvia . 6,646 parts In-Stock

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Kulean Microsystems

USA . 6,605 parts In-Stock

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Perfect Parts

USA . 3,931 parts In-Stock

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GreenTree Electronics

Israel . 825 parts In-Stock

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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SupplyDigital Components

Austria . 749 parts In-Stock

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Overview

Unleash the power of innovation with the NTPF360N65S3H by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers unparalleled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a breakthrough in performance with a minimum DS breakdown voltage of 650 V and a maximum operating temperature of 150°C. With a maximum drain current of 10 A and a low on-resistance of 0.36 ohm, this transistor provides exceptional value and efficiency. Experience the difference with Onsemi's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this transistor a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency and reliability of switching operations in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle high voltage levels, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 28 A

Capable of handling high pulsed currents, making it suitable for applications where short bursts of high current are required.

Maximum Power Dissipation (Abs): 26 W

Can dissipate high power levels effectively, ensuring the transistor operates within safe temperature limits.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without compromising performance, ideal for industrial or high-power applications.

Maximum Drain-Source On Resistance: 0.36 ohm

Low on-resistance helps minimize power losses and improve efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTPF360N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

75 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF360N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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