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NTPF095N65S3H

Onsemi

NTPF095N65S3H by Onsemi

NTPF095N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 84A IDM, and 0.095 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 40W. This N-CHANNEL transistor has a SILICON element and can withstand temperatures from -55 to 150 °C.

Median Price

$7.850

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 657 parts In-Stock

1+ parts

$7.850

100+ parts

$4.020

1k+ parts

$3.960

10k+ parts

-

657

$7.850

$4.020

$3.960

-

DigiKey

USA . 674 parts In-Stock

1+ parts

$8.060

100+ parts

$4.026

1k+ parts

$3.465

10k+ parts

-

674

$8.060

$4.026

$3.465

-

Chip1Stop

Japan . 855 parts In-Stock

1+ parts

$23.700

100+ parts

$9.900

1k+ parts

$7.440

10k+ parts

-

855

$23.700

$9.900

$7.440

-

Rochester

USA . 3,828 parts In-Stock

1+ parts

-

100+ parts

$3.470

1k+ parts

$3.100

10k+ parts

$2.920

3,828

-

$3.470

$3.100

$2.920

Verical

USA . 3,828 parts In-Stock

1+ parts

-

100+ parts

$4.338

1k+ parts

$3.875

10k+ parts

$3.650

3,828

-

$4.338

$3.875

$3.650

Flip Electronics (Authorized)

USA . 793 parts In-Stock

1+ parts

-

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793

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Avnet

USA . 600 parts In-Stock

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600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 719 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

-

10k+ parts

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719

$2.242

-

-

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Vyrian

USA . 1,423 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

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1,423

$2.360

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Flip Electronics

USA . 2,793 parts In-Stock

1+ parts

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2,793

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NAC Semi

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$9.070

1k+ parts

-

10k+ parts

$8.160

2,400

-

$9.070

-

$8.160

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 502 parts In-Stock

1+ parts

$2.124

100+ parts

-

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-

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502

$2.124

-

-

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Corohmni

South Africa . 228 parts In-Stock

1+ parts

$2.360

100+ parts

-

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228

$2.360

-

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Component Stockers USA

USA . 6,337 parts In-Stock

1+ parts

$4.090

100+ parts

$3.850

1k+ parts

$3.480

10k+ parts

-

6,337

$4.090

$3.850

$3.480

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Continental Prestige Electronics

USA . 866 parts In-Stock

1+ parts

$5.760

100+ parts

$3.770

1k+ parts

$3.280

10k+ parts

-

866

$5.760

$3.770

$3.280

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Microchip USA

USA . 4,412 parts In-Stock

1+ parts

$19.572

100+ parts

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4,412

$19.572

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QUARKTWIN TECHNOLOGY LTD

USA . 29,775 parts In-Stock

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29,775

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TANS Electronics

Latvia . 7,193 parts In-Stock

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7,193

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Kulean Microsystems

USA . 5,513 parts In-Stock

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5,513

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SupplyDigital Components

Austria . 5,025 parts In-Stock

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5,025

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Perfect Parts

USA . 4,178 parts In-Stock

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4,178

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Problanco Electronics

Mexico . 2,586 parts In-Stock

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2,586

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GreenTree Electronics

Israel . 955 parts In-Stock

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955

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UHIMA Technologies

Türkiye . 323 parts In-Stock

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323

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Overview

Experience the power of innovation with the NTPF095N65S3H by Onsemi. As a leader in the industry, Onsemi is known for delivering top-quality Power Field Effect Transistors that excel in performance and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a built-in diode for added convenience. With a high breakdown voltage of 650V and an impressive maximum pulsed drain current of 84A, this transistor ensures optimal functionality and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NTPF095N65S3H - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance and efficiency compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for reverse current protection, enhancing the reliability of the FET in switching applications.

Transistor Application: SWITCHING

Specifically designed for high-speed switching applications where efficiency and speed are crucial.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the FET to handle high voltages, making it suitable for a wide range of power applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, making it easier to integrate the FET into circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have lower ON resistance and faster switching speeds, improving overall performance.

Maximum Pulsed Drain Current (IDM): 84 A

High pulsed current rating allows the FET to handle sudden spikes in current without damage, making it reliable in dynamic applications.

Avalanche Energy Rating (EAS): 284 mJ

Higher energy rating indicates the FET's ability to handle sudden voltage spikes, improving robustness in harsh electrical environments.

No. of Terminals: 3

Simple and easy to integrate into circuit designs with fewer connections needed.

Maximum Power Dissipation (Abs): 40 W

Capable of dissipating up to 40 watts of power without damage, ensuring reliable operation under high power conditions.

Maximum Operating Temperature: 150 °C

High operating temperature range allows the FET to operate in a wide range of environmental conditions without performance degradation.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability, making them a popular choice for various power applications.

Maximum Drain Current (ID): 30 A

Can handle a continuous drain current of 30A, suitable for powering high current devices or circuits.

Maximum Drain-Source On Resistance: 0.095 ohm

Low ON resistance minimizes power loss and heat generation, improving efficiency in power switching applications.

Terminal Position: SINGLE

Simplified terminal layout makes installation and connection easier, reducing the chances of error during circuit design.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing electrical interference and shorts in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTPF095N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

284 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF095N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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