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NTPF3D2N12MC

Onsemi

NTPF3D2N12MC by Onsemi

NTPF3D2N12MC by Onsemi is a Power FET with 120V DS Breakdown Voltage, 83A Drain Current, and 0.0032 ohm On Resistance. Ideal for switching applications, this N-CHANNEL transistor operates in Enhancement Mode with a max power dissipation of 45W.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,795 parts In-Stock

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Vyrian

USA . 769 parts In-Stock

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769

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TANS Electronics

Latvia . 7,579 parts In-Stock

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Problanco Electronics

Mexico . 4,577 parts In-Stock

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Kulean Microsystems

USA . 3,991 parts In-Stock

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SupplyDigital Components

Austria . 3,543 parts In-Stock

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Corphita

USA . 2,486 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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UHIMA Technologies

Türkiye . 341 parts In-Stock

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Overview

Experience the ultimate power and efficiency with the NTPF3D2N12MC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product they create. Designed for switching applications, this N-CHANNEL Power Field Effect Transistor offers enhanced performance and durability. With a built-in diode and high breakdown voltage of 120V, this transistor ensures optimal functionality and protection. Trust Onsemi to provide you with the best-in-class components for all your power needs. Elevate your projects with the NTPF3D2N12MC and experience unmatched performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the channel, making the FET suitable for applications requiring high-speed switching.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in tasks that require frequent on/off cycles.

Minimum DS Breakdown Voltage: 120 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, making it suitable for demanding applications.

Maximum Drain Current (ID): 83 A

Capable of handling high currents, making it ideal for applications that require power switching capabilities.

Maximum Power Dissipation (Abs): 45 W

Can dissipate heat effectively, preventing overheating and ensuring reliable operation even under high power conditions.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.0032 ohm

Low on-resistance leads to minimal power loss and efficient power handling, making it a reliable choice for power electronics.

Avalanche Energy Rating (EAS): 490 mJ

High avalanche energy rating ensures reliable operation in applications where voltage spikes or transients may occur.

Technical Specifications

Power Field Effect Transistors (FET) NTPF3D2N12MC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

490 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (Abs) (ID):

83 A

Maximum Drain Current (ID):

83 A

Maximum Drain-Source On Resistance:

.0032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

32 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTPF3D2N12MC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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