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NTMSD3P303R2G

Onsemi

NTMSD3P303R2G by Onsemi

NTMSD3P303R2G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 2.34A, 0.085 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. With GULL WING terminals and a RECTANGULAR package shape, it offers high performance in small outline designs at up to 150 °C operating temperature.

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Lifecycle Status

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In-Stock Inventory

1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 55 parts In-Stock

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Assy Fe

Spain . 10,000 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Problanco Electronics

Mexico . 4,668 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 623 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 447 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Overview

Unlock the power of advanced technology with the NTMSD3P303R2G by Onsemi. Designed for switching applications, this P-CHANNEL FET offers unparalleled performance and reliability. With a maximum drain current of 2.34 A and a low on-resistance of 0.085 ohm, this transistor provides superior efficiency and precision. Its small outline package and gull wing terminals make it easy to integrate into any project, while the built-in diode ensures seamless operation. Trust in Onsemi's expertise in semiconductor technology and elevate your designs with the NTMSD3P303R2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

Suitable for circuits requiring P-channel transistors, offering flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing the need for additional components.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency.

Surface Mount: YES

Facilitates easy and compact PCB assembly, saving space and making it suitable for miniaturized devices.

Minimum DS Breakdown Voltage: 30 V

Withstands high voltage levels, ensuring reliable performance in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers low input capacitance and high input impedance, making it suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

Can operate in a wide temperature range, suitable for applications with varying environmental conditions.

Maximum Drain-Source On Resistance: 0.085 ohm

Low on-resistance minimizes power dissipation and improves efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMSD3P303R2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

2.34 A

Maximum Drain Current (ID):

2.34 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

135 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMSD3P303R2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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